公开(公告)号：USRE37637E1

公开(公告)日：2002-04-09

申请号：US09433094

申请日：1999-11-03

Applicant: Mark Bradford Clifton ,  Richard Michael Flynn ,  Fred William Verdi

Inventor： Mark Bradford Clifton ,  Richard Michael Flynn ,  Fred William Verdi

IPC: H01C2302

CPC classification number: G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

Abstract translation: 大约0.004至0.007英寸厚的薄半导体管芯基本位于智能卡的中性平面上，该中性面被定义为在智能卡弯曲期间基本上没有机械应变的平面，从而提供具有改进的抵抗力的智能卡 机械挠曲和/或具有改进的RF性能的智能卡。

公开(公告)号：US06521275B1

公开(公告)日：2003-02-18

申请号：US09680615

申请日：2000-10-06

Applicant: Vincent Mercogliano ,  Sam Farella ,  William Verdi ,  Joseph Verdi

Inventor： Vincent Mercogliano ,  Sam Farella ,  William Verdi ,  Joseph Verdi

IPC: A23L33409

CPC classification number: A23B4/16 ,  A23V2002/00 ,  A23V2200/10 ,  A23V2250/112 ,  A23V2250/118

Abstract: A meat preservation process using a carbon monoxide and helium mixture as a preservant which achieves a limited penetration into the meat such that the color of the meat is not altered after cooking, comprising, applying a vacuum to the meat to remove atmospheric gases from the surface of the meat, introducing the carbon monoxide and helium mixture to achieve a limited penetration of the mixture into the surface of the meat, and applying a second vacuum to the meat.

Abstract translation: 一种使用一氧化碳和氦气混合物作为保存剂的肉类保存方法，其实现了肉中有限的渗透，使得烹饪后肉的颜色不改变，包括：向肉中施加真空以从表面除去大气中的气体 的肉，引入一氧化碳和氦混合物以实现混合物有限地渗入肉的表面，并向肉施加第二个真空。

公开(公告)号：US5719437A

公开(公告)日：1998-02-17

申请号：US635072

申请日：1996-04-19

Applicant: Mark Bradford Clifton ,  Richard Michael Flynn ,  Fred William Verdi

Inventor： Mark Bradford Clifton ,  Richard Michael Flynn ,  Fred William Verdi

IPC: H01L23/04 ,  G06K19/077 ,  H01L23/08 ,  H01C23/02 ,  H01C23/34 ,  H01C23/495

CPC classification number: G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002

Abstract: Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

公开(公告)号：US06239359B1

公开(公告)日：2001-05-29

申请号：US09309943

申请日：1999-05-11

Applicant: Peter Frederick Lilienthal, II ,  Fred William Verdi

Inventor： Peter Frederick Lilienthal, II ,  Fred William Verdi

IPC: H05K900

CPC classification number: H05K9/0028

Abstract: An EMI shield for use on a printed wiring board (PWB) of a circuit pack includes an open-ended box-like structure having a laterally extending flange completely encircling the opening into the box-like structure. The box is of an EMI impervious material, preferably stainless steel. An electrically conductive O-ring gasket is disposed in a groove in the flange. Both the groove and the flange completely encircle the box opening. The shield is secured to a PWB by pegs secured to the flange at positions radially outwardly of the gasket and extending entirely through openings through the PWB. Preferred pegs comprises pairs of side-by-side prongs integral with the shield flange but extending downwardly therefrom. Each prong terminates in an oppositely directed, return-bent detent with the detent pairs functioning as a spring-biased latch for removably mounting the shield to the PWB.

Abstract translation: 用于电路板的印刷电路板（PWB）的EMI屏蔽件包括开口的盒状结构，其具有完全环绕开口的横向延伸的凸缘进入盒状结构。 该盒子是EMI不透水材料，优选不锈钢。 导电O型圈垫片设置在凸缘的凹槽中。 凹槽和凸缘都完全包围盒子开口。 屏蔽件通过固定到凸缘的钉子固定到PWB，该垫片位于衬垫的径向外侧的位置处，并通过开口穿过PWB完全延伸。 优选的销钉包括与屏蔽凸缘成一体但从其向下延伸的并排侧插脚对。 每个插脚终止于相反导向的回弯定位器，止动对用作弹簧偏置闩锁，用于可拆卸地将屏蔽件安装到PWB上。