公开(公告)号：US5696327A

公开(公告)日：1997-12-09

申请号：US344841

申请日：1994-11-23

申请人： He Huang ,  Maarten P. de Boer ,  John C. Nelson ,  Feng Wang ,  William W. Gerberich

发明人： He Huang ,  Maarten P. de Boer ,  John C. Nelson ,  Feng Wang ,  William W. Gerberich

IPC分类号： G01N19/04 ,  G01N3/24

CPC分类号： G01N19/04 ,  Y10T156/1983

摘要： An apparatus and method for separating a thin film from a substrate, the thin film having a surface with a selected width, includes an indenter for applying a force to the surface of the thin film that is substantially equal along the selected width. The forces are applied until separation of a portion of the thin film from the substrate occurs. In a preferred embodiment, the indenter is made from a block of material having a substantially flat surface engageable with the surface of the thin film. The substantially flat surface of the block of material has a width at least equal to the width of the surface of the thin film. Based on the two dimensional geometry of the mechanics, accurate analysis of work of adhesion is achieved.

摘要翻译： 一种用于从基片上分离薄膜的装置和方法，所述薄膜具有选定宽度的表面，包括用于向所述薄膜表面施加力的压头，所述压力沿所选择的宽度基本相等。 施加力，直到发生部分薄膜与基板分离。 在优选实施例中，压头由具有与薄膜表面接合的基本平坦的表面的材料块制成。 材料块的基本上平坦的表面的宽度至少等于薄膜表面的宽度。 基于力学的二维几何形状，实现了粘附工作的准确分析。

公开(公告)号：US5344551A

公开(公告)日：1994-09-06

申请号：US122043

申请日：1993-09-14

申请人： Chung-hsien Tsai ,  John C. Nelson ,  Joachim V. R. Herberlein ,  Emil Pfender ,  William W. Gerberich

发明人： Chung-hsien Tsai ,  John C. Nelson ,  Joachim V. R. Herberlein ,  Emil Pfender ,  William W. Gerberich

IPC分类号： C23C16/00 ,  C23C16/02 ,  C23C16/26 ,  C23C16/27 ,  C23C28/00

CPC分类号： C23C16/27 ,  C23C16/0272 ,  C23C16/271 ,  C23C16/276 ,  Y10T428/12486 ,  Y10T428/12625 ,  Y10T428/12937

摘要： A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.

摘要翻译： 提供了一种在衬底上制备金刚石涂层的方法。 该方法包括将具有有效量的空隙区域的部分金刚石涂层施加到基板的工作表面的第一步骤。 在后续步骤中，部分涂层中的空隙区域填充有粘合剂，优选金属粘合剂。 在后续步骤中，从粘合剂向外突出的金刚石进一步生长，以产生覆盖部分或与粘合剂或粘合剂材料延伸并保持关系的头部。 根据本发明，还提供优选的产品。

公开(公告)号：US5260141A

公开(公告)日：1993-11-09

申请号：US800408

申请日：1991-11-29

申请人： Chung-hsien Tsai ,  John C. Nelson ,  Joachim V. R. Heberlein ,  Emil Pfender ,  William W. Gerberich

发明人： Chung-hsien Tsai ,  John C. Nelson ,  Joachim V. R. Heberlein ,  Emil Pfender ,  William W. Gerberich

IPC分类号： C23C16/00 ,  C23C16/02 ,  C23C16/26 ,  C23C16/27

CPC分类号： C23C16/27 ,  C23C16/0272 ,  C23C16/271 ,  C23C16/276 ,  Y10T428/12486 ,  Y10T428/12625 ,  Y10T428/12937

摘要： A method is provided for preparing a diamond coating on a substrate. The method includes a first step of applying a partial diamond coating having an effective amount of void area therein to the work surface of a substrate. In a follow-up step the void area in the partial coating is filled with binder, preferably metallic binder. In a later step, diamond projecting outwardly from the binder is further grown, to generate a covering portion or a head portion extending over, and in protective relationship with, the binder or binder material. According to the present invention preferred products are also provided.

摘要翻译： 提供了一种在衬底上制备金刚石涂层的方法。 该方法包括将具有有效量的空隙区域的部分金刚石涂层施加到基板的工作表面的第一步骤。 在后续步骤中，部分涂层中的空隙区域填充有粘合剂，优选金属粘合剂。 在后续步骤中，从粘合剂向外突出的金刚石进一步生长，以产生覆盖部分或与粘合剂或粘合剂材料延伸并保持关系的头部。 根据本发明，还提供优选的产品。