公开(公告)号：US06304151B1

公开(公告)日：2001-10-16

申请号：US09651026

申请日：2000-08-30

申请人： Hiroshi Uehara ,  Toshikatsu Makuta ,  Seiji Oda ,  Tatsunobu Shibuya ,  Susumu Negishi ,  Xinglong Gong

发明人： Hiroshi Uehara ,  Toshikatsu Makuta ,  Seiji Oda ,  Tatsunobu Shibuya ,  Susumu Negishi ,  Xinglong Gong

IPC分类号： H03B104

CPC分类号： H03B5/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599

摘要： There is provided a crystal oscillator including a vessel main body having a concave portion, a cover bonded to the vessel main body so as to form an encapsulated vessel together with the vessel main body, a crystal blank held within the vessel, an IC (integrated circuit) chip containing an oscillating circuit utilizing the crystal blank and having a plurality of IC terminals on a major surface thereof, a plurality of circuit terminals formed on a bottom surface of the concave portion of the vessel main body at positions corresponding to the positions of the IC terminals, respectively. The IC chip is fixed to the bottom surface of the concave portion of the vessel main body by effecting face down bonding so that the IC terminals are bonded to the circuit terminals through bumps. At least one of the IC terminals is a group-arranged terminal including a plurality of unit terminals commonly connected to one another, and the plurality of unit terminals are s connected to corresponding circuit terminals through respective bumps.

摘要翻译： 提供了一种晶体振荡器，其包括具有凹部的容器主体，与容器主体结合以形成与容器主体一起形成密封容器的盖，保持在容器内的晶体坯，IC（集成 电路）芯片，其包含利用晶体坯料的振荡电路，并且在其主表面上具有多个IC端子，多个电路端子形成在容器主体的凹部的底表面上的位置处 IC终端。 通过进行面朝下的接合，将IC芯片固定在容器主体的凹部的底面，使得IC端子通过凸块接合到电路端子。 IC端子中的至少一个是包括共同连接的多个单元端子的组排列端子，并且多个单元端子通过相应的凸块连接到相应的电路端子。

公开(公告)号：US06445254B1

公开(公告)日：2002-09-03

申请号：US09651023

申请日：2000-08-30

申请人： Tatsunobu Shibuya ,  Susumu Negishi ,  Hiroshi Uehara ,  Yasuo Sakaba ,  Seiji Oda ,  Xinglong Gong

发明人： Tatsunobu Shibuya ,  Susumu Negishi ,  Hiroshi Uehara ,  Yasuo Sakaba ,  Seiji Oda ,  Xinglong Gong

IPC分类号： H03B104

CPC分类号： H03B5/32

摘要： There is provided a crystal oscillator in which a crystal blank and an integrated circuit (IC) chip are accommodated in a vessel and the IC chip is fixed through a bump to the bottom surface of the vessel by means of ultrasonic thermocompression bonding. The IC chip contains an oscillation circuit utilizing the crystal blank and has a plurality of terminal electrodes on a major surface thereof. A plurality of connection terminal portions are formed on the bottom surface of the concave portion of the vessel so that each of the connection terminal portions corresponds to one of the terminal electrodes. Each of the connection terminal portions is formed into a rectangular shape and the width of each connection terminal portion is identical. The terminal electrodes and the connection terminal portions are bonded to each other through a bump by means of ultrasonic thermocompression bonding. Thus, the IC chip is fixed to the bottom surface of the concave portion of the vessel.

摘要翻译： 提供了一种晶体振荡器，其中将晶体空白和集成电路（IC）芯片容纳在容器中，并且通过超声波热压接将IC芯片通过凸块固定到容器的底表面。 IC芯片包含利用晶体坯的振荡电路，并在其主表面上具有多个端子电极。 多个连接端子部形成在容器的凹部的底面上，使得各个连接端子部对应于一个端子电极。 每个连接端子部分形成为矩形，并且每个连接端子部分的宽度相同。 端子电极和连接端子部通过超声波热压接通过凸块彼此接合。 因此，IC芯片固定在容器的凹部的底面。