摘要:
An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.
摘要:
A heat dissipating module is provided. The heat dissipating module includes a first heat dissipating unit and a second heat dissipating unit. The first heat dissipating unit has a first connecting portion. The second heat dissipating unit has a second connecting portion corresponding to the first connecting portion. The second connecting portion and the first connecting portion are connected to each other tightly.
摘要:
An identification module for facilitating installation of a functional component includes a circuit board having a first connecting portion, a first functional component, a first primary label disposed on the first connecting portion and a first subsidiary label disposed on the first functional component, wherein the first subsidiary label and the first primary label respectively have two first identifying symbols corresponding to each other. With intuitional identify the first identifying symbols, a correlation between the first functional component and the first connecting portion is easily cognized, therefore facilitates installation and increase efficiency and yield thereof.