Electronic device and heat dissipating module thereof
    1.
    发明授权
    Electronic device and heat dissipating module thereof 有权
    电子装置及其散热模块

    公开(公告)号:US08018721B2

    公开(公告)日:2011-09-13

    申请号:US12624655

    申请日:2009-11-24

    IPC分类号: H05K7/20 F28F7/00

    摘要: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.

    摘要翻译: 提供一种包括电路板和散热模块的电子设备。 电路板有一个热源。 散热模块设置在热源上,具有导热单元,第一散热单元和第二散热单元。 导热单元具有导热板和热管。 导热板的第一表面接触热源。 热管的第一端连接到导热板。 第一散热单元连接到热管的第二端。 第二散热单元可移动地设置在导热板的第二表面上。 本发明的散热模块可以通过不同的冷却模式实现双散热效率,从而满足高速处理器的散热要求。

    Heat Dissipating Module
    5.
    发明申请
    Heat Dissipating Module 审中-公开
    散热模块

    公开(公告)号:US20100126709A1

    公开(公告)日:2010-05-27

    申请号:US12614527

    申请日:2009-11-09

    IPC分类号: F28F7/00

    摘要: A heat dissipating module is provided. The heat dissipating module includes a first heat dissipating unit and a second heat dissipating unit. The first heat dissipating unit has a first connecting portion. The second heat dissipating unit has a second connecting portion corresponding to the first connecting portion. The second connecting portion and the first connecting portion are connected to each other tightly.

    摘要翻译: 提供散热模块。 散热模块包括第一散热单元和第二散热单元。 第一散热单元具有第一连接部。 第二散热单元具有对应于第一连接部的第二连接部。 第二连接部分和第一连接部分彼此紧密连接。

    IP telephone
    6.
    外观设计
    IP telephone 有权
    IP电话

    公开(公告)号:USD555143S1

    公开(公告)日:2007-11-13

    申请号:US29262535

    申请日:2006-07-06

    申请人: Ya-Chyi Chou

    设计人: Ya-Chyi Chou

    IDENTIFICATION MODULE FOR FACILITATING INSTALLATION OF FUNCTIONAL COMPONENT
    9.
    发明申请
    IDENTIFICATION MODULE FOR FACILITATING INSTALLATION OF FUNCTIONAL COMPONENT 审中-公开
    用于促进功能组件安装的识别模块

    公开(公告)号:US20100162597A1

    公开(公告)日:2010-07-01

    申请号:US12644491

    申请日:2009-12-22

    IPC分类号: G09F3/00

    CPC分类号: G09F3/00 G09F3/02 G09F3/10

    摘要: An identification module for facilitating installation of a functional component includes a circuit board having a first connecting portion, a first functional component, a first primary label disposed on the first connecting portion and a first subsidiary label disposed on the first functional component, wherein the first subsidiary label and the first primary label respectively have two first identifying symbols corresponding to each other. With intuitional identify the first identifying symbols, a correlation between the first functional component and the first connecting portion is easily cognized, therefore facilitates installation and increase efficiency and yield thereof.

    摘要翻译: 一种便于安装功能部件的识别模块包括具有第一连接部分,第一功能部件,设置在第一连接部分上的第一主标签和设置在第一功能部件上的第一辅助标签的电路板,其中第一 辅助标签和第一主标签分别具有彼此对应的两个第一识别符号。 通过直观地识别第一识别符号,第一功能部件和第一连接部分之间的相关性容易被认知,因此有利于安装并提高其效率和产量。