公开(公告)号：US20090108986A1

公开(公告)日：2009-04-30

申请号：US12066846

申请日：2006-09-21

申请人： Koichi Urano ,  Yasushi Akahane

发明人： Koichi Urano ,  Yasushi Akahane

IPC分类号： H01C7/00

CPC分类号： H01C1/142 ,  H01C1/012 ,  H01C7/003 ,  H01C17/006

摘要： [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield.[Solution] The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

摘要翻译： [问题]提供一种片状电阻器，其容易降低其电阻并显示出优异的制造产量。 [解决方案]芯片电阻器10包括形状为长方体的陶瓷基板11。 安装在陶瓷基板11的下表面上的电阻元件12主要由低电阻，低TCR铜 - 镍合金，形成两层结构的第一和第二电极层13,14构成，并且覆盖 电阻元件12的两个纵向端部和用于覆盖电阻元件12的剩余区域的绝缘保护层15.电阻元件12位于陶瓷基板11的下表面的周边边界内的区域内。 片状电阻器10还包括位于陶瓷基板11的两个纵向端面上的端面电极17.第二电极层14和端面电极17被电镀层18-21覆盖。 该芯片电阻器10面向下安装有位于电路板30的布线图案31上的两个电极层13,14。

公开(公告)号：US07782173B2

公开(公告)日：2010-08-24

申请号：US12066846

申请日：2006-09-21

申请人： Koichi Urano ,  Yasushi Akahane

发明人： Koichi Urano ,  Yasushi Akahane

IPC分类号： H01C1/012

CPC分类号： H01C1/142 ,  H01C1/012 ,  H01C7/003 ,  H01C17/006

摘要： The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

摘要翻译： 芯片电阻器10包括形状为长方体的陶瓷基板11。 安装在陶瓷基板11的下表面上的电阻元件12主要由低电阻，低TCR铜 - 镍合金，形成两层结构的第一和第二电极层13,14构成，并且覆盖 电阻元件12的两个纵向端部和用于覆盖电阻元件12的剩余区域的绝缘保护层15.电阻元件12位于陶瓷基板11的下表面的周边边界内的区域内。 片状电阻器10还包括位于陶瓷基板11的两个纵向端面上的端面电极17.第二电极层14和端面电极17被电镀层18-21覆盖。 该芯片电阻器10面向下安装有位于电路板30的布线图案31上的两个电极层13,14。