公开(公告)号：US5197537A

公开(公告)日：1993-03-30

申请号：US423469

申请日：1989-10-02

申请人： Junji Chigira ,  Koichi Urano

发明人： Junji Chigira ,  Koichi Urano

IPC分类号： B23Q11/14 ,  F25D17/02 ,  G05D23/24

CPC分类号： F28F27/00 ,  B23Q11/141 ,  F25D17/02 ,  G05D23/1919 ,  G05D23/1931 ,  G05D23/24 ,  F28D2021/0077 ,  Y10S62/10

摘要： A temperature control apparatus for a machine tool includes four temperature sensors for detecting a reference temperature, outlet temperature of heat transfer fluid at an outlet of a heat exchanger, and temperatures of the heat transfer fluid at both inlet and an outlet of a machine tool element having a heat generating source. The four temperature sensors are arranged to constitute a differential temperature detecting means that activates control means to control temperature of the heat transfer fluid from the heat exchanger so as to minimize both deviations of heat transfer fluid temperature and steady-state deviations of machine tool body temperature.

摘要翻译： PCT No.PCT / JP89 / 00553 Sec。 371 1990年10月2日第 102（e）日期1990年10月2日PCT申请1989年6月1日PCT公布。 出版物WO89 / 12527 日本1989年12月28日。一种用于机床的温度控制装置包括四个温度传感器，用于检测参考温度，换热器出口处的传热流体的出口温度，以及传热流体在入口和 具有发热源的机床元件的出口。 四个温度传感器被构造成构成差动温度检测装置，其启动控制装置以控制来自热交换器的传热流体的温度，从而最小化传热流体温度的偏差和机床体温的稳态偏差 。

公开(公告)号：US20090108986A1

公开(公告)日：2009-04-30

申请号：US12066846

申请日：2006-09-21

申请人： Koichi Urano ,  Yasushi Akahane

发明人： Koichi Urano ,  Yasushi Akahane

IPC分类号： H01C7/00

CPC分类号： H01C1/142 ,  H01C1/012 ,  H01C7/003 ,  H01C17/006

摘要： [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield.[Solution] The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

摘要翻译： [问题]提供一种片状电阻器，其容易降低其电阻并显示出优异的制造产量。 [解决方案]芯片电阻器10包括形状为长方体的陶瓷基板11。 安装在陶瓷基板11的下表面上的电阻元件12主要由低电阻，低TCR铜 - 镍合金，形成两层结构的第一和第二电极层13,14构成，并且覆盖 电阻元件12的两个纵向端部和用于覆盖电阻元件12的剩余区域的绝缘保护层15.电阻元件12位于陶瓷基板11的下表面的周边边界内的区域内。 片状电阻器10还包括位于陶瓷基板11的两个纵向端面上的端面电极17.第二电极层14和端面电极17被电镀层18-21覆盖。 该芯片电阻器10面向下安装有位于电路板30的布线图案31上的两个电极层13,14。

公开(公告)号：US07782174B2

公开(公告)日：2010-08-24

申请号：US12066844

申请日：2006-09-15

申请人： Koichi Urano

发明人： Koichi Urano

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C1/012 ,  H01C1/142

摘要： Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.

摘要翻译： 公开了一种片状电阻器1，其包括陶瓷基板2，位于陶瓷基板2的下表面的两个纵向端上的一对堤起部基座部分3，一对第一电极层4，其覆盖至少部分 升降基础部分3并且彼此以预定距离定位，主要由铜 - 镍合金制成的用于桥接第一电极层4的电阻元件5，覆盖第一电极层4的一对第二电极层6 一对第一电极层4和覆盖电阻元件5的绝缘保护层7.此外，端面电极9位于陶瓷基板2的两个纵向端面上。第二电极层6和端面电极 9被镀层10-13覆盖。 该芯片电阻器1面向下安装有位于电路板20的布线图案21上的第一和第二电极4,6。

公开(公告)号：US07782173B2

公开(公告)日：2010-08-24

申请号：US12066846

申请日：2006-09-21

申请人： Koichi Urano ,  Yasushi Akahane

发明人： Koichi Urano ,  Yasushi Akahane

IPC分类号： H01C1/012

CPC分类号： H01C1/142 ,  H01C1/012 ,  H01C7/003 ,  H01C17/006

摘要： The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

摘要翻译： 芯片电阻器10包括形状为长方体的陶瓷基板11。 安装在陶瓷基板11的下表面上的电阻元件12主要由低电阻，低TCR铜 - 镍合金，形成两层结构的第一和第二电极层13,14构成，并且覆盖 电阻元件12的两个纵向端部和用于覆盖电阻元件12的剩余区域的绝缘保护层15.电阻元件12位于陶瓷基板11的下表面的周边边界内的区域内。 片状电阻器10还包括位于陶瓷基板11的两个纵向端面上的端面电极17.第二电极层14和端面电极17被电镀层18-21覆盖。 该芯片电阻器10面向下安装有位于电路板30的布线图案31上的两个电极层13,14。

公开(公告)号：US20090115569A1

公开(公告)日：2009-05-07

申请号：US12066844

申请日：2006-09-15

申请人： Koichi Urano

发明人： Koichi Urano

IPC分类号： H01C7/00 ,  H01C1/142

CPC分类号： H01C7/003 ,  H01C1/012 ,  H01C1/142

摘要： [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance.[Solution] Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.

摘要翻译： [问题]提供不太可能遭受安装故障并且能够容易地降低其电阻的芯片电阻器。 [解决方案]公开了一种片状电阻器1，其包括陶瓷基板2，位于陶瓷基板2的下表面的两个纵向端上的一对堤坝基部3，覆盖在陶瓷基板2的下表面的一对第一电极层4 堤坝基部3的最少部分并且彼此相隔预定的距离;主要由铜 - 镍合金制成的用于桥接第一电极层4的电阻元件5，一对第二电极层6 覆盖一对第一电极层4和覆盖电阻元件5的绝缘保护层7.此外，端面电极9位于陶瓷基板2的两个纵向端面上。第二电极层6和端部 表面电极9被电镀层10-13覆盖。 该芯片电阻器1面向下安装有位于电路板20的布线图案21上的第一和第二电极4,6。

公开(公告)号：US5476137A

公开(公告)日：1995-12-19

申请号：US300845

申请日：1994-09-06

申请人： Akira Ochiai ,  Kouya Watanabe ,  Kyoichi Ebisawa ,  Koichi Urano

发明人： Akira Ochiai ,  Kouya Watanabe ,  Kyoichi Ebisawa ,  Koichi Urano

IPC分类号： B23Q11/14 ,  F25B29/00

CPC分类号： B23Q11/141 ,  B23Q11/143 ,  Y10S62/10

摘要： A control system for effecting ultra-precision temperature control for a controlled system having large load fluctuations or including a dead time component. A control unit (5) instructs a high-precision PID temperature controller (10) to renew and correct a control target value T.sub.0,NEW for the supply fluid temperature T.sub.0 only by a temperature difference .DELTA.T=T.sub.C -T.sub.2 between a set value T.sub.C for the return fluid temperature T.sub.2 of a heat transfer fluid and the actually controlled return fluid temperature T.sub.2. In response to the instruction, the high-precision PID temperature controller (10) controls the heating power of a heater (17) for heating control through a constant-power thyristor phase controller (16). The heater (17) heats the heat transfer fluid and sends it to a machining apparatus (1) through a closed damping tank (21). The heat transfer fluid exchanges heat with the machining apparatus (1) and is then returned to a precooling means.

摘要翻译： 一种用于对具有大负载波动或包括死区时间分量的受控系统进行超精密温度控制的控制系统。 控制单元（5）指示高精度PID温度控制器（10）更新和校正供给流体温度T0的控制目标值T0，NEW，仅通过设定值TC之间的温差DELTA T = TC-T2 对于传热流体的返回流体温度T2和实际控制的回流温度T2。 响应于该指令，高精度PID温度控制器（10）通过恒功率晶闸管相位控制器（16）控制用于加热控制的加热器（17）的加热功率。 加热器（17）加热传热流体并通过封闭的阻尼罐（21）将其送到加工设备（1）。 传热流体与加工装置（1）进行热交换，然后返回到预冷装置。