公开(公告)号：US5954929A

公开(公告)日：1999-09-21

申请号：US738660

申请日：1996-10-30

申请人： Naoki Uchiyama ,  Munenori Mashima ,  Makoto Kinoshita ,  Yorishige Hashimoto

发明人： Naoki Uchiyama ,  Munenori Mashima ,  Makoto Kinoshita ,  Yorishige Hashimoto

IPC分类号： C23C14/56 ,  C23C14/04 ,  C23C30/00 ,  G11B5/85 ,  G11B7/26 ,  C23C14/00

CPC分类号： C23C14/042 ,  G11B7/26

摘要： A deposition-preventing part, particularly a masking tool, which is used over an area to be protected from adhesion of a physical vapor deposition film, for physical vapor deposition apparatuses which are used to form physical vapor deposition films of metals, particularly noble metals, on CD-ROM, CD-R or CD-E substrates. One or more of a solder-plated Cu wire, a solder-plated Cu foil tape, an Al foil tape and a synthetic resin tape are attached, in a peelable manner, on a solder film formed on the surface of the substrate of a deposition-preventing part such as a masking tool, which has a surface roughness of 0.01-1 .mu.m when expressed as the arithmetic mean roughness defined according to JIS B 0601, a thickness of 5-100 .mu.m and a melting point of 100-450.degree. C.

摘要翻译： 在用于形成金属，特别是贵金属的物理气相沉积膜的物理气相沉积装置中，在要被保护的物理气相沉积膜的粘附区域上使用的防沉积部分，特别是掩模工具， 在CD-ROM，CD-R或CD-E底物上。 将一个或多个焊料镀覆的Cu线，焊料镀覆的Cu箔带，Al箔带和合成树脂带以可剥离的方式附着在形成在沉积基板的表面上的焊料膜上 当表示为根据JIS B 0601定义的算术平均粗糙度时，其表面粗糙度为0.01-1μm的掩模工具，其厚度为5-100μm，熔点为100-450 DEG C.