公开(公告)号：US07776426B2

公开(公告)日：2010-08-17

申请号：US11365887

申请日：2006-03-02

申请人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

发明人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

IPC分类号： B32B9/00

CPC分类号： H01L23/3735 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0545 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability of preventing etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material (8 and 9) formed on the ceramic substrate, and a circuit pattern section jointed to the patterns of brazing material. The patterns of brazing material includes a line pattern along the edge of the circuit pattern. Also, a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

摘要翻译： 提供一种陶瓷电路基板及其制造方法，其通过在电路图形部分和陶瓷基板之间形成间隙而具有优异的耐热冲击性，并且具有防止蚀刻残渣残留的能力。 根据本发明的陶瓷电路基板包括形成在陶瓷基板上的钎焊材料（8和9）的图案，以及连接到钎焊材料图案的电路图形部分。 钎焊材料的图案包括沿着电路图案的边缘的线图案。 此外，在位于陶瓷基板和电路图案之间的线图案内形成间隙。

公开(公告)号：US20060198994A1

公开(公告)日：2006-09-07

申请号：US11365887

申请日：2006-03-02

申请人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

发明人： Yoshiharu Itahana ,  Junji Nakamura ,  Akio Sawabe

IPC分类号： B32B3/00

CPC分类号： H01L23/3735 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0545 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability to prevent etchant residue from remaining therein. The ceramic circuit substrate according to the present invention includes patterns of brazing material 8 and 9 formed on the ceramic substrate, a circuit pattern section jointed onto the pattern of brazing material; wherein the pattern of brazing material includes a line pattern along the edge of the circuit pattern, and a gap is formed within the line pattern located between the ceramic substrate and the circuit pattern.

摘要翻译： 提供一种陶瓷电路基板及其制造方法，其通过在电路图案部和陶瓷基板之间形成间隙而具有优异的耐热冲击性，并且具有防止蚀刻残渣残留的能力。 根据本发明的陶瓷电路基板包括形成在陶瓷基板上的钎焊材料8和9的图案，连接到钎焊材料图案上的电路图形部分; 其中钎焊材料的图案包括沿着电路图案的边缘的线图案，并且在位于陶瓷基板和电路图案之间的线图案内形成间隙。