公开(公告)号：US20110100806A1

公开(公告)日：2011-05-05

申请号：US12999425

申请日：2009-06-16

申请人： Satoshi Sugawara ,  Yasuhiro Enami ,  Kazuki Takahashi ,  Susumu Kumagawa ,  Yousong Jiang ,  Ichiro Shiono ,  Yoshihiro Takasaka

发明人： Satoshi Sugawara ,  Yasuhiro Enami ,  Kazuki Takahashi ,  Susumu Kumagawa ,  Yousong Jiang ,  Ichiro Shiono ,  Yoshihiro Takasaka

IPC分类号： C23C14/34 ,  C23C14/50

CPC分类号： C23C14/505 ,  C23C14/345 ,  H01J37/32706 ,  H01J37/32733 ,  H01J37/34

摘要： [Object] To provide a bias sputtering device having a self-revolving mechanism capable of reducing generation of foreign substances adhered to film formation surfaces.[Solution] In a bias sputtering device 1 provided with a substrate holder 12 having a self-revolving mechanism, the substrate holder 12 has a revolving member 21 and turning holders 23, and on the side of back surfaces of substrates 14 respectively attached to the turning holders 23, disc shaped substrate electrodes 30 having the same size as the substrates 14 are provided at positions distant from the substrates 14 by 0.5 to 10 mm.

摘要翻译： 本发明提供一种具有能够减少附着于成膜面的异物产生的自转机构的偏压溅射装置。 [解决方案]在设置有具有自转机构的基板保持件12的偏压溅射装置1中，基板保持件12具有旋转构件21和转动保持件23，并且在分别附接到基板保持件12的基板14的背面侧 转动保持器23，具有与基板14相同尺寸的盘形基板电极30设置在远离基板14的位置上0.5至10mm。