公开(公告)号：US12130303B2

公开(公告)日：2024-10-29

申请号：US18524231

申请日：2023-11-30

申请人： SEIKO EPSON CORPORATION

发明人： Fumiya Ito

IPC分类号： G01P15/135 ,  B81B7/00 ,  G01P15/08 ,  G01P15/125

CPC分类号： G01P15/135 ,  B81B7/0016 ,  G01P15/0802 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0831 ,  G01P2015/0871

摘要： A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.

公开(公告)号：US20240327198A1

公开(公告)日：2024-10-03

申请号：US18619807

申请日：2024-03-28

申请人： ROHM CO., LTD.

发明人： Martin Wilfried HELLER ,  Toma FUJITA

IPC分类号： B81B3/00 ,  G01P15/125

CPC分类号： B81B3/0027 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2203/051

摘要： An acceleration detection device includes: a substrate including cavity; an anchor mechanically connected to the substrate inside the cavity; a spring mechanically connected to the anchor; a mass mechanically connected to the spring; a first movable electrode mechanically connected to and electrically insulated from the mass; a first fixed electrode mechanically connected to and electrically insulated from the substrate; a pair of second movable electrodes facing each other by being mechanically connected to and electrically insulated from the mass; and a second fixed electrode mechanically connected to and electrically insulated from the substrate to be interposed between the pair of second movable electrodes, the second fixed electrode generating an electrostatic force between the pair of second movable electrodes and the second fixed electrode when a voltage is applied to each of the pair of second movable electrodes and the second fixed electrode.

公开(公告)号：US20240302405A1

公开(公告)日：2024-09-12

申请号：US18119492

申请日：2023-03-09

申请人： InvenSense, Inc.

发明人： Roberto Martini ,  Luca Coronato ,  Xian Huang

IPC分类号： G01P15/18 ,  B81B7/02 ,  G01P15/125

CPC分类号： G01P15/18 ,  B81B7/02 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0848

摘要： A dual axis accelerometer with a single proof mass measures in-plane acceleration (e.g., either along an x-axis or a y-axis), out-of-plane acceleration (e.g., normal to an x-y plane), and tilt of a fixed portion of a MEMS layer (e.g., normal to the x-y plane). In response to a tilt measurement, the dual-axis accelerometer compensates any offset (e.g., variability) of the out-of-plane accelerometer in order to maintain offset stability. In some embodiments, multiple dual axis accelerometers, perpendicularly configured, may be implemented via processing circuitry to offer three axis sensitivity capability.

公开(公告)号：US12077429B2

公开(公告)日：2024-09-03

申请号：US17421330

申请日：2020-02-27

申请人： Robert Bosch GmbH

发明人： Lars Tebje ,  Jochen Reinmuth ,  Johannes Classen

IPC分类号： B81B7/02 ,  B81C1/00 ,  G01C19/5783 ,  G01L7/08 ,  G01L19/00 ,  G01P15/08 ,  G01P15/125

CPC分类号： B81B7/02 ,  B81C1/00341 ,  G01C19/5783 ,  G01L7/082 ,  G01L19/0092 ,  G01P15/0802 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C2201/0105 ,  B81C2201/014

摘要： A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.

公开(公告)号：US12066756B2

公开(公告)日：2024-08-20

申请号：US17876873

申请日：2022-07-29

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Chi-Hung Liao ,  Yueh-Lin Yang

IPC分类号： G03F1/24 ,  B81B3/00 ,  G01C19/5712 ,  G01P15/125 ,  G01P15/13 ,  G03F1/22 ,  G03F1/48 ,  G03F1/60 ,  G03F7/00 ,  G01P15/08 ,  H01L21/033 ,  H01L21/308 ,  H01L21/3213 ,  H01L21/683

CPC分类号： G03F1/24 ,  B81B3/0021 ,  G01C19/5712 ,  G01P15/125 ,  G01P15/131 ,  G03F1/22 ,  G03F1/48 ,  G03F1/60 ,  G03F7/70033 ,  B81B2201/025 ,  B81B2203/0181 ,  B81B2203/04 ,  B81B2207/07 ,  G01P2015/0831 ,  H01L21/0337 ,  H01L21/3086 ,  H01L21/32139 ,  H01L21/6833

摘要： A method includes holding a mask using an electrostatic chuck. The mask includes a substrate having a first bump and a second bump separated from the first bump and a patterned layer. The first bump and the second bump face the electrostatic chuck. The substrate is between the patterned layer and the electrostatic chuck. The first bump and the second bump are spaced apart from the patterned layer. The first bump and the second bump are ring strips in a top view, and the first bump has a rectangular cross section and the second bump has a triangular cross section. The method further includes generating extreme ultraviolet (EUV) radiation using an EUV light source; and directing the EUV radiation toward the mask, such that the EUV radiation is reflected by the mask.

公开(公告)号：US20240186971A1

公开(公告)日：2024-06-06

申请号：US18070081

申请日：2022-11-28

申请人： InvenSense, Inc.

发明人： Luca Collamati ,  Federico Mazzarella

IPC分类号： H03F3/70 ,  G01D5/24 ,  G01P15/125 ,  G01P15/14

CPC分类号： H03F3/70 ,  G01D5/24 ,  G01P15/125 ,  G01P15/14

摘要： A capacitive sensing charge amplifier, e.g., in a direct current (DC) feedback network, may incorporate a switching capacitor, including a first control switch and a second control switch, which receives a switching signal to charge and discharges the switching signal to a virtual ground of a sense amplifier. Noise incorporated into the output of the sense amplifier (e.g., a MEMS output signal) is filtered by a demodulation signal at a demodulator such that the period average noise at the demodulator output equals zero. The time varying nature of the switching capacitor resistance generally reshapes the system's post-demodulation noise to reduce its low frequency output noise.

公开(公告)号：US20240182296A1

公开(公告)日：2024-06-06

申请号：US18525319

申请日：2023-11-30

申请人： Robert Bosch GmbH

发明人： Johannes Classen

IPC分类号： B81B7/02 ,  G01P15/125

CPC分类号： B81B7/02 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0814

摘要： A micromechanical capacitive z-acceleration sensor. The sensor includes a substrate with a main extension plane and a layer sequence which is parallel to the extension plane, and includes a first polysilicon layer, a second polysilicon layer, and a third polysilicon layer, with a movable micromechanical structure having a seismic mass which can be deflected in a straight line in a first direction perpendicular to the extension plane. The movable micromechanical structure is formed in the second polysilicon layer and the third polysilicon layer. A measuring capacitance is formed between the seismic mass and a measuring electrode formed in the first polysilicon layer. A reference capacitance is formed between lower and upper reference electrodes, which are formed in the first and polysilicon layers, respectively. As viewed in the first direction, the movable micromechanical structure at least partially overlaps the upper reference electrode.

公开(公告)号：US20240132341A1

公开(公告)日：2024-04-25

申请号：US18381027

申请日：2023-10-16

申请人： COMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Emmanuel HARDY ,  Bruno FAIN ,  Elisa VIANELLO

IPC分类号： B81B7/02 ,  G01P15/125

CPC分类号： B81B7/02 ,  G01P15/125 ,  B81B2201/0271

摘要： A MEMS resonant sensor adapted to generate a pulse output signal from a signal of interest, the signal of interest being a signal having a frequency oscillating around a carrier frequency, the MEMS sensor comprising at least one processing channel for processing the signal of interest, each processing channel comprising: a demodulation unit for demodulating the signal of interest in order to form a demodulated signal, the demodulation unit comprising a frequency mixer between the signal of interest and a reference signal, the demodulated signal having a low-frequency component and a high-frequency component; a filtration unit for filtering the demodulated signal in order to form a filtered signal, the filtration unit being adapted to allow through the low-frequency component of the demodulated signal; a comparison unit for comparing the filtered signal with a fixed threshold signal in order to form a comparison signal, the comparison signal comprising rising edges and falling edges; a detection unit for detecting rising edges, each rising edge corresponding to a pulse of the output signal.

公开(公告)号：US20240118306A1

公开(公告)日：2024-04-11

申请号：US17938203

申请日：2022-10-05

申请人： Honeywell International Inc.

发明人： Paul W. Dwyer ,  Robert J. Meyer

IPC分类号： G01P15/125 ,  G01P15/13

CPC分类号： G01P15/125 ,  G01P15/131

摘要： In some examples, an accelerometer system includes a first excitation ring comprising: a first housing; and a first cover removably attached to the first housing, wherein the first housing and the first cover define a first recess. The accelerometer system also includes a second excitation ring comprising: a second housing; and a second cover removably attached to the second housing, wherein the second housing and the second cover define a second recess. The accelerometer system also includes a proof mass assembly; and processing circuitry located within one or both of the first recess and the second recess, wherein the first excitation ring and the second excitation ring shield the processing circuitry from harmful levels of radiation existing outside of the accelerometer system, and wherein the processing circuitry is configured to maintain a proof mass of the proof mass assembly in a null position.

公开(公告)号：US20240103035A1

公开(公告)日：2024-03-28

申请号：US17769075

申请日：2020-09-25

申请人： Robert Bosch GmbH

发明人： Johannes Classen ,  Michael Saettler

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P2015/0871

摘要： A micromechanical component, in particular, an inertial sensor, including a seismic mass, a substrate, and a cap. The component includes a reference electrode, which is in a first electrode layer and is connected to the substrate, and a further reference electrode, which is in a second electrode layer and is connected to the cap. The seismic mass is deflectable on two sides, in a direction perpendicular to the major plane of extension of the reference electrode. The seismic mass includes a flexible limit stop in the direction of deflection towards the first electrode layer. The flexible limit stop is connected to the main part of the seismic mass using a spring element. The spring element is in an elastic layer, which is positioned between a layer of the main part of the seismic mass and the first electrode layer.