Method for cutting specific layer of synthetic resin laminated film
    1.
    发明授权
    Method for cutting specific layer of synthetic resin laminated film 失效
    合成树脂层压膜特定层切割方法

    公开(公告)号:US4323757A

    公开(公告)日:1982-04-06

    申请号:US174065

    申请日:1980-07-31

    摘要: A method for cutting a specific layer of a synthetic resin laminated film comprising at least two kinds of closely laminated synthetic resin material film layers having spectral absorption characteristics different from each other, which comprisesplacing the focus of a laser ray having a wavelength that enables the laser ray to be absorbed by the specific film layer to be cut and transmitted through the film layer not to be cut, on said specific film layer directly or through the other transmitting film layer; andmoving the focus of the laser ray on the plane of said specific film layer, moving said specific film layer on the plane of said specific film layer under a stationary laser focus, or forcing the focus and said specific film layer, respectively, to move in conjunction, keeping the focus on the plane of said specific film layer, whereby said specific film layer only will be selectively cut along the predetermined line or curve.

    摘要翻译: 一种用于切割合成树脂层压膜的特定层的方法,其包括具有彼此不同的光谱吸收特性的至少两种紧密层压的合成树脂材料膜层,其包括放置具有使能 要被要切割的特定薄膜层吸收的激光射线直接或通过另一个透射薄膜层在所述特定薄膜层上透过不被切割的薄膜层; 并且将激光束的焦点移动到所述特定膜层的平面上,在固定的激光焦点下使所述特定膜层的平面上移动所述特定膜层,或分别迫使焦点和所述特定膜层移动 将焦点保持在所述特定膜层的平面上,由此所述特定膜层仅沿着预定线或曲线选择性地切割。