公开(公告)号：US20100000776A1

公开(公告)日：2010-01-07

申请号：US12492382

申请日：2009-06-26

申请人： Deok-heung Kim ,  Young-duck Kwon

发明人： Deok-heung Kim ,  Young-duck Kwon

IPC分类号： H05K1/11 ,  H01B13/00

CPC分类号： H05K3/067 ,  H05K3/06 ,  H05K3/242 ,  H05K2201/0338 ,  H05K2203/025 ,  H05K2203/1184

摘要： Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

摘要翻译： 提供一种电路板及其制造方法。 该方法包括：在绝缘基板上形成金属的焊盘部分和引线部分，其中引线部分连接到焊盘部分; 在所述焊盘部分和所述引线部分上形成导电层，其中所述导电层具有包含金的上表面; 在所述导电层上形成蚀刻掩模，以暴露与所述导电层中的所述引线部分相对应的部分; 使用含有酸的蚀刻溶液蚀刻由蚀刻掩模暴露的引线部分的一部分和与引线部分相对应的导电层的一部分; 并去除蚀刻掩模。

公开(公告)号：US08431029B2

公开(公告)日：2013-04-30

申请号：US12492382

申请日：2009-06-26

申请人： Young-duck Kwon ,  Deok-heung Kim

发明人： Young-duck Kwon ,  Deok-heung Kim

IPC分类号： H01B13/00

CPC分类号： H05K3/067 ,  H05K3/06 ,  H05K3/242 ,  H05K2201/0338 ,  H05K2203/025 ,  H05K2203/1184

摘要： Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

摘要翻译： 提供一种电路板及其制造方法。 该方法包括：在绝缘基板上形成金属的焊盘部分和引线部分，其中引线部分连接到焊盘部分; 在所述焊盘部分和所述引线部分上形成导电层，其中所述导电层具有包含金的上表面; 在所述导电层上形成蚀刻掩模，以暴露与所述导电层中的所述引线部分相对应的部分; 使用含有酸的蚀刻溶液蚀刻由蚀刻掩模暴露的引线部分的一部分和与引线部分相对应的导电层的一部分; 并去除蚀刻掩模。