公开(公告)号：US20110101528A1

公开(公告)日：2011-05-05

申请号：US12696276

申请日：2010-01-29

申请人： Yousuke Akimoto ,  Makoto Wada

发明人： Yousuke Akimoto ,  Makoto Wada

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/53276 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76838 ,  H01L21/76855 ,  H01L21/76876 ,  H01L23/5226 ,  H01L2924/0002 ,  Y10S977/72 ,  H01L2924/00

摘要： A semiconductor device according to one embodiment includes: a substrate; a wiring provided above the substrate and including a graphene nanoribbon layer comprising a plurality of laminated graphene nanoribbon sheets; and a wiring connecting member penetrating at least one of the plurality of graphene nanoribbon sheets for connecting the wiring and a conductive member above or below the wiring.

摘要翻译： 根据一个实施例的半导体器件包括：衬底; 设置在所述基板上方并且包括石墨烯纳米纤维层的布线，所述石墨烯纳米纤维层包括多个层叠的石墨烯纳米薄片; 以及布线连接构件，其穿透所述多个石墨烯纳米纤维板中的至少一个，用于将所述布线连接到所述布线上方或下方的导电构件。

公开(公告)号：US08169085B2

公开(公告)日：2012-05-01

申请号：US12696276

申请日：2010-01-29

申请人： Yousuke Akimoto ,  Makoto Wada

发明人： Yousuke Akimoto ,  Makoto Wada

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/53276 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76838 ,  H01L21/76855 ,  H01L21/76876 ,  H01L23/5226 ,  H01L2924/0002 ,  Y10S977/72 ,  H01L2924/00

摘要： A semiconductor device according to one embodiment includes: a substrate; a wiring provided above the substrate and including a graphene nanoribbon layer comprising a plurality of laminated graphene nanoribbon sheets; and a wiring connecting member penetrating at least one of the plurality of graphene nanoribbon sheets for connecting the wiring and a conductive member above or below the wiring.

摘要翻译： 根据一个实施例的半导体器件包括：衬底; 设置在所述基板上方并且包括石墨烯纳米纤维层的布线，所述石墨烯纳米纤维层包括多个层叠的石墨烯纳米薄片; 以及布线连接构件，其穿透所述多个石墨烯纳米纤维板中的至少一个，用于将所述布线连接到所述布线上方或下方的导电构件。