利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.01 秒)

    LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
    1.
    发明申请
    LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME 有权
    层压型陶瓷电子元件及其制造方法

    公开(公告)号：US20110266036A1

    公开(公告)日：2011-11-03

    申请号：US13181572

    申请日：2011-07-13

    申请人： Yuichi IIDA ,  Yusuke OTSUKA

    发明人： Yuichi IIDA ,  Yusuke OTSUKA

    IPC分类号： H05K1/03 ,  C03B29/00

    CPC分类号： H05K1/167 ,  B32B18/00 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  H05K1/0306 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2203/308

    摘要： A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.

    摘要翻译： 叠层型陶瓷电子部件包括厚膜电阻器和外涂层，以便防止在产生分层之类的缺陷，并且防止厚膜电阻器在激光修整之后破裂，即使采用不熟悉的方法 将复合层叠体进行焙烧，使得未烧结的陶瓷层压体，未烧结的厚膜电阻器和未烧结的外涂层均被一体烧结。 未焙烧的外涂层包括含有陶瓷和玻璃的玻璃陶瓷材料，其具有与未焙烧陶瓷层中所含的玻璃的成分和组成比基本相同的成分和组成比。 调整构成未烧结的陶瓷层和未烧结的外涂层的各玻璃陶瓷材料，使得在外涂层中，具有比煅烧陶瓷层的热膨胀系数小的热膨胀系数的结晶相的比例高于 在陶瓷层中。

    Laminate type ceramic electronic component and method for manufacturing same
    4.
    发明授权
    Laminate type ceramic electronic component and method for manufacturing same 有权
    层叠型陶瓷电子部件及其制造方法

    公开(公告)号：US08491834B2

    公开(公告)日：2013-07-23

    申请号：US13181572

    申请日：2011-07-13

    申请人： Yuichi Iida ,  Yusuke Otsuka

    发明人： Yuichi Iida ,  Yusuke Otsuka

    IPC分类号： C04B33/32

    CPC分类号： H05K1/167 ,  B32B18/00 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  H05K1/0306 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2203/308

    摘要： A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.

    摘要翻译： 叠层型陶瓷电子部件包括厚膜电阻器和外涂层，以便防止在产生分层之类的缺陷，并且防止厚膜电阻器在激光修整之后破裂，即使采用不熟悉的方法 将复合层叠体进行焙烧，使得未烧结的陶瓷层压体，未烧结的厚膜电阻器和未烧结的外涂层均被一体烧结。 未焙烧的外涂层包括含有陶瓷和玻璃的玻璃陶瓷材料，其具有与未焙烧陶瓷层中所含的玻璃的成分和组成比基本相同的成分和组成比。 调整构成未烧结的陶瓷层和未烧结的外涂层的各玻璃陶瓷材料，使得在外涂层中，具有比煅烧陶瓷层的热膨胀系数小的热膨胀系数的结晶相的比例高于 在陶瓷层中。