公开(公告)号：US20110026752A1

公开(公告)日：2011-02-03

申请号：US12918360

申请日：2009-07-17

申请人： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

发明人： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

IPC分类号： H04R19/04 ,  H05K9/00 ,  H04R31/00

CPC分类号： H05K13/046 ,  B23P17/04 ,  H04R19/04 ,  Y10T29/49 ,  Y10T29/49005 ,  Y10T29/4957 ,  Y10T29/49993

摘要： A miniature microphone is provided. In one embodiment, the miniature microphone comprises: a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and one or more electrical components are installed on the other side thereof; a protection frame with a cavity in the central portion thereof, wherein one or more components are installed inside the cavity, the outer side of the protection frame forms the body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and a bottom plate, wherein one or more sound holes are provided in the central portion thereof for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame. Since a metal shielding layer and an insulating mechanism are provided on the inner side the protection frame of the miniature microphone, the electromagnetic shielding effect is good, meanwhile, an inner short circuit can be prevented in the miniature microphone. Besides, the production costs are low and the manufacturing process is simple.

摘要翻译： 提供微型麦克风。 在一个实施例中，微型麦克风包括：在微型麦克风的上部的电路板基板，其中多个接触垫被配置在电路板基板的一侧上的规定位置，并且一个或多个电气部件安装在 其另一面; 其中心部分具有空腔的保护框架，其中一个或多个部件安装在所述腔体的内部，所述保护框架的外侧形成所述主体部分，在所述主体部分的内表面上设置第一金属屏蔽层 并且在第一金属屏蔽层的内侧设置有绝缘机构，其能够使一个或多个部件与第一金属屏蔽层电绝缘; 和底板，其中在其中央部分设置有一个或多个声孔用于通过声音，并且在与保护框架接触的底板的整个表面上设置第二金属屏蔽层。 由于在微型麦克风的保护框架的内侧设有金属屏蔽层和绝缘机构，因此电磁屏蔽效果好，同时可以防止微型麦克风内部短路。 此外，生产成本低，制造工艺简单。

公开(公告)号：US20100295202A1

公开(公告)日：2010-11-25

申请号：US12541798

申请日：2009-08-14

申请人： Yongjun Tian ,  Fengrong Yu ,  Dongli Yu ,  Jianjun Zhang ,  Bo Xu ,  Zhongyuan Liu ,  Julong He

发明人： Yongjun Tian ,  Fengrong Yu ,  Dongli Yu ,  Jianjun Zhang ,  Bo Xu ,  Zhongyuan Liu ,  Julong He

IPC分类号： H01L35/34

CPC分类号： B22F9/04 ,  B22F1/0018 ,  B22F3/14 ,  B22F3/16 ,  B22F2009/041 ,  B82Y30/00 ,  H01L35/16 ,  H01L35/34

摘要： The present invention provides a method for the fabrication of high performance densified nanocrystalline bulk thermoelectric material, comprising: (1) preparing a thermoelectric alloy nanopowders by a ball milling process to achieve an average crystal size of 5-30 nm, and (2) preparing the nanocrystalline bulk thermoelectric material by high pressure sintering at a temperature of 0.25-0.8 Tm under a pressure of 0.8-6.0 GPa for 10-120 minutes, to achieve a relative density of 90-100% and an average grain size of 10-50 nm. The method is easy to operate and allows the production of a thermoelectric material with a ZT value higher than 2. In addition, the method can ensure both good thermoelectric properties and high density, and therefore have important applications for energy industry.

摘要翻译： 本发明提供一种制造高性能致密纳米晶体热电材料的方法，包括：（1）通过球磨法制备热电合金纳米粉末，以获得5-30nm的平均晶体尺寸，和（2）制备 通过在0.8-6.0GPa的压力下在0.25-0.8Tm的温度下高压烧结10-120分钟的纳米晶体热电材料，达到90-100％的相对密度和10-50的平均晶粒尺寸 nm。 该方法易于操作，并且允许制造ZT值高于2的热电材料。此外，该方法可以确保良好的热电性能和高密度，因此在能源工业中具有重要的应用。

公开(公告)号：US08553921B2

公开(公告)日：2013-10-08

申请号：US12918360

申请日：2009-07-17

申请人： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

发明人： Rongguo Yao ,  Zhongyuan Liu ,  Xianbin Wang ,  Maoqiang Dang ,  Shaoyang Yao

IPC分类号： H04R25/00

CPC分类号： H05K13/046 ,  B23P17/04 ,  H04R19/04 ,  Y10T29/49 ,  Y10T29/49005 ,  Y10T29/4957 ,  Y10T29/49993

摘要： A miniature microphone is provided. In one embodiment, the miniature microphone comprises: a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and one or more electrical components are installed on the other side thereof; a protection frame with a cavity in the central portion thereoftherein, wherein one or more components are installed inside the cavity, the outer side of the protection frame forms the body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and a bottom plate, wherein one or more sound holes are provided in the central portion thereoftherein for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame.

摘要翻译： 提供微型麦克风。 在一个实施例中，微型麦克风包括：在微型麦克风的上部的电路板基板，其中多个接触垫被配置在电路板基板的一侧上的规定位置，并且一个或多个电气部件安装在 其另一面; 保护框架，在其中央部分具有空腔，其中一个或多个部件安装在腔体内部，保护框架的外侧形成主体部分，第一金属屏蔽层设置在主体部分的内表面上 并且在第一金属屏蔽层的内侧设置有绝缘机构，其能够使一个或多个部件与第一金属屏蔽层电绝缘; 和底板，其中在其中用于通过声音的中心部分设置有一个或多个声孔，并且在与保护框架接触的底板的整个表面上设置第二金属屏蔽层。