BIMETALLIC WELDING ELECTRODE
    1.
    发明申请

    公开(公告)号:US20180236610A1

    公开(公告)日:2018-08-23

    申请号:US15954814

    申请日:2018-04-17

    IPC分类号: B23K35/30 B23K35/40 B23K35/02

    摘要: An electrode is disclosed for use in MIG/MAG welding. The electrode comprises an elongated electrode body within which is embedded a metallic filament. In some embodiments, the filament is copper, and is offset from the center of the electrode body. A method is disclosed for forming an electrode. The method may include removing oxidation from a surface of an electrode body, forming the electrode body to a desired size and geometry, removing lubricants from the surface of the electrode body, forming an elongated channel in a surface of the electrode body, depositing a filament in the elongated channel, and forming the electrode body over the filament. Other embodiments are disclosed and claimed.

    Metal encapsulated composite seal

    公开(公告)号:US09951575B2

    公开(公告)日:2018-04-24

    申请号:US12525295

    申请日:2008-01-22

    申请人: Brian Haynes

    发明人: Brian Haynes

    摘要: A system, in certain embodiments, has a composite seal with both a metal shell and an elastic core, such as an elastomer core. In one embodiment, the composite seal has an annular metal shell with a top, a bottom, and a seal interface disposed between the top and the bottom. The composite seal also has an elastomer disposed within the annular metal shell, wherein the elastomer is configured to impart pressure against the seal interface.

    Miniature microphone, protection frame thereof and method for manufacturing the same
    10.
    发明授权
    Miniature microphone, protection frame thereof and method for manufacturing the same 有权
    微型麦克风,保护框架及其制造方法

    公开(公告)号:US09271435B2

    公开(公告)日:2016-02-23

    申请号:US13653598

    申请日:2012-10-17

    申请人: GOERTEK INC.

    IPC分类号: H04R19/04 H05K13/04 B23P17/04

    摘要: A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.

    摘要翻译: 提供一种制造用于微型麦克风的保护框架的方法。 在一个实施例中,该方法包括以下步骤:(1)制备由具有规定厚度和规定面积的绝缘材料制成的基板; (2)在基板上以规定的间隔形成多个孔; (3)在形成在基板上的多个孔的内表面上形成第一金属屏蔽层; (4)在多个孔中填充绝缘材料; (5)在基板的两面的表面上形成多个延伸部,每个延伸部分覆盖绝缘材料的端面的一部分和孔的第一金属屏蔽层的整个端面; (6)在每个绝缘材料填充孔中形成空腔,每个空腔的口径略小于在上述步骤(5)中形成的对应延伸部分的内口径; 和(7)从所述基板切割所述多个孔以产生保护框架的集合。