RESIN BONDED CUT-OFF TOOL
    1.
    发明申请

    公开(公告)号:US20190126436A1

    公开(公告)日:2019-05-02

    申请号:US16095514

    申请日:2017-04-17

    Abstract: The invention relates to a resin bonded cut-off tool. The resin bonded cut-off tool comprises rod shaped sintered bauxite abrasives, wherein an amount of the rod shaped sintered bauxite abrasives is at least 10% to 90% by weight, based on 100% by weight of a Grinding Active Matrix (GAM) of the cut-off tool. The resin bonded cut-off tool comprises further a bonding agent in an amount of 10% to 40% by weight, based on 100% by weight of the GAM of the cut-off tool and fused and/or sintered abrasives in an amount sufficient to bring the GAM of the cut-off tool to 100% by weight.

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