公开(公告)号：US20210319955A1

公开(公告)日：2021-10-14

申请号：US16949910

申请日：2019-05-16

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Ankit Mahajan ,  Saagar A. Shah ,  Mikhail L. Pekurovsky ,  Thomas J. Metzler ,  Kayla C. Niccum ,  Eric A. Vandre ,  Aniruddha Upadhye ,  Robert R. Owings ,  Jeremy K. Larsen ,  Zohaib Hameed

IPC分类号： H01G4/33 ,  H01F17/00 ,  H01F41/04 ,  H01C17/075 ,  H01C7/00 ,  H01C1/01 ,  H01C1/034 ,  H01C17/00 ,  H01G2/06 ,  H01G4/005 ,  H01G4/224

摘要： Ultrathin and flexible electrical devices including circuit dies such as, for example, a capacitor chip, a resistor chip, and/or an inductor chip, and methods of making and using the same are provided. Circuit dies are attached to a major surface of a flexible substrate having channels Electrically conductive traces are formed in the channels, self-aligned with the circuit dies, and in direct contact with the bottom surface of the circuit dies.