公开(公告)号：US20210195743A1

公开(公告)日：2021-06-24

申请号：US16077804

申请日：2017-02-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Donato G. Caraig ,  Choong Meng How ,  Ravi Palaniswamy ,  Alejandro Aldrin A. Narag, II ,  Bing Liu

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10

Abstract: A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.