Abstract:
A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.
Abstract:
Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
Abstract:
Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
Abstract:
Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
Abstract:
Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
Abstract:
A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).
Abstract:
Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.
Abstract:
A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.
Abstract:
A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).
Abstract:
Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.