公开(公告)号：US20210370475A1

公开(公告)日：2021-12-02

申请号：US15733073

申请日：2018-10-31

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Masaaki Ichikawa ,  Shoichi Masuda

IPC: B24D15/04 ,  B24D11/02

Abstract: Object: Providing a polishing pad that is deformable with a smaller force. Solution: A polishing pad (1) according to an aspect of the invention includes a substrate (2) made of a piece of non-woven fabric. The substrate (2) has a flat-plate shape extending in a first direction perpendicular to a thickness direction and in a second direction perpendicular to both the thickness direction and the first direction. The substrate (2) is divided into a plurality of blocks (3) arranged in the second direction and each extending in the first direction. A boundary portion (4) extending in the first direction is formed between each pair of the blocks (3), and a plurality of slits (6) are formed in the boundary portion (4). Each of the slits (6) is formed through the substrate (2) in the thickness direction and extends in first direction. The plurality of slits (6) that exist in the boundary portion (4) are spaced apart from each other in the first direction. A pair of the blocks (3) that are next to each other in the second direction are connected to each other by a connection portion (7) formed between the slits (6).