公开(公告)号：US10344169B2

公开(公告)日：2019-07-09

申请号：US15508360

申请日：2015-09-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Yoshihiko Tasaka ,  Zachary J. Thompson ,  Jun Fujita ,  Takahiro Kasahara ,  Sotaro Endo

IPC: C08F220/34 ,  C08F20/54 ,  C09D4/00 ,  C09D133/08 ,  B05D1/28 ,  B05D7/00 ,  G02B5/30

Abstract: A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.

公开(公告)号：US20170247547A1

公开(公告)日：2017-08-31

申请号：US15508360

申请日：2015-09-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Yoshihiko Tasaka ,  Zachary J. Thompson ,  Jun Fujita ,  Takahiro Kasahara ,  Sotaro Endo

IPC: C09D4/00 ,  B05D7/00 ,  G02B5/30 ,  B05D1/28

CPC classification number: C09D4/00 ,  B05D1/28 ,  B05D7/544 ,  C08F220/34 ,  C09D133/08 ,  G02B5/30 ,  C08F2220/343 ,  C08F2220/1883 ,  C08F220/54

Abstract: A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.