Paint composition and multilayer coating film formation method

    公开(公告)号:US12031050B2

    公开(公告)日:2024-07-09

    申请号:US17190502

    申请日:2021-03-03

    发明人: Takashi Kitamura

    摘要: To provide a paint composition capable of forming a coating film having a small graininess, having high flip-flop property, and having excellent chipping resistance and adhesion. According to the present invention, there is provided a paint composition including a hydroxy group-containing acrylic resin (A), a hydroxy group-containing polyester resin (B), an amino resin (C), and a titanium oxide-coated light interference pigment (D), which has an L*15 value of 100 or more and an L*110 value of 65 or less, wherein the solid content of the hydroxy group-containing acrylic resin (A) is in the range of 20 to 60 parts by mass, the solid content of the hydroxy group-containing polyester resin (B) is in the range of 10 to 50 parts by mass, the solid content of the amino resin (C) is in the range of 5 to 40 parts by mass, and the solid content of the titanium oxide-coated light interference pigment (D) is in the range of 3 to 25 parts by mass, relative to 100 parts by mass of the total solid content of the hydroxy group-containing acrylic resin (A), the hydroxy group-containing polyester resin (B), and the amino resin (C).

    MULTI-LAYER COATING FILM
    7.
    发明公开

    公开(公告)号:US20240141182A1

    公开(公告)日:2024-05-02

    申请号:US18273346

    申请日:2022-02-21

    摘要: An object of the present invention is to provide a multi-layer coating film having at least a clear coating film and a base coating film and having good chipping resistance, and preferably to provide a multi-layer coating film further having good designability. The multi-layer coating film of the present invention is a multi-layer coating film comprising a substrate, a base layer formed thereon, and a clear layer formed on the base layer, wherein the base layer comprises a luster pigment, wherein the base layer has an erosion index of 45 μm2/g or less where the erosion index is a value obtained by multiplying an erosion rate of the base layer by a thickness of the base layer, and wherein the erosion rate of the base layer is measured using a micro slurry jet erosion method at a projection power at which an erosion rate with respect to a silicon wafer is 0.635 μm/g.