中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

3 records (took 0.015 seconds)

    RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THEREFROM
    2.
    发明申请
    RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THEREFROM 有权
    树脂组合物和电介质层和电容器

    公开(公告)号：US20140362494A1

    公开(公告)日：2014-12-11

    申请号：US14361730

    申请日：2011-12-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Tao Cheng ,  Qilin Chen ,  Zhou Jin

    IPC: H01G4/20

    CPC classification number: H01G9/07 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G4/203 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15 ,  H05K1/0366 ,  H05K2201/0293

    Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

    Abstract translation: 本发明提供一种树脂组合物，其包含：1〜20重量份的增强纤维; 0.2〜5重量份的防沉降剂; 20〜40重量份的环氧树脂; 0.1〜3重量份的固化剂; 和50至75重量份的高介电常数填料。 本发明还提供由该树脂组合物制成的电介质层和包含电介质层的电容器。 在由本发明提供的树脂组合物制成的电介质层中，纤维可以均匀分散并且可以提高树脂组合物的机械强度，并与环氧树脂配合以提供优异的韧性。 因此，在PCB双面蚀刻工艺中使用电介质层时，可以显着提高所制造的电介质层的机械强度，并且可以有效克服其脆性。

    RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THEREFROM
    3.
    发明申请
    RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THEREFROM 审中-公开
    树脂组合物和电介质层和电容器

    公开(公告)号：US20160372269A1

    公开(公告)日：2016-12-22

    申请号：US15251214

    申请日：2016-08-30

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Tao Cheng ,  Qilin Chen ,  Zhou Jin

    IPC: H01G9/07 ,  H01G9/055 ,  C08K7/08 ,  C08K3/24 ,  C08K7/14 ,  H01G9/15 ,  H01G9/042

    CPC classification number: H01G9/07 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G4/203 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15 ,  H05K1/0366 ,  H05K2201/0293

    Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

    Abstract translation: 本发明提供一种树脂组合物，其包含：1〜20重量份的增强纤维; 0.2〜5重量份的防沉降剂; 20〜40重量份的环氧树脂; 0.1〜3重量份的固化剂; 和50至75重量份的高介电常数填料。 本发明还提供由该树脂组合物制成的电介质层和包含电介质层的电容器。 在由本发明提供的树脂组合物制成的电介质层中，纤维可以均匀分散并且可以提高树脂组合物的机械强度，并与环氧树脂配合以提供优异的韧性。 因此，在PCB双面蚀刻工艺中使用电介质层时，可以显着提高所制造的电介质层的机械强度，并且可以有效克服其脆性。

Patent Agency Ranking