公开(公告)号：US20190052006A1

公开(公告)日：2019-02-14

申请号：US16164874

申请日：2018-10-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/72 ,  H01R13/6471 ,  H01R12/79

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US20160006151A1

公开(公告)日：2016-01-07

申请号：US14770108

申请日：2013-03-04

Applicant: Deng LIU ,  3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/72

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

Abstract translation: 本发明提供一种电互连系统，包括：一个桨卡，包括多个第一接触垫，其位于所述桨形卡的第一表面上;多个第二接触垫位于所述桨形卡的相对的第二表面上; 第一晶片，包括多个第一导体，每个第一导体均具有第一接触部分; 以及第二晶片，其包括多个第二导体，每个具有第二接触部分; 其中所述第一晶片和所述第二晶片组装在一起，以使所述第一接触部分和所述第二接触部分彼此面对，并且能够在其间形成间隙，以容纳所述桨片的至少一部分; 每个第一接触部分适于与对应的第一接触焊盘电接触，并且当所述桨卡至少部分地容纳在间隙中时，每个第二接触部分适于与相应的第二接触垫电接触。

公开(公告)号：US10312615B2

公开(公告)日：2019-06-04

申请号：US16164874

申请日：2018-10-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/58 ,  H01R12/73 ,  H01R13/514 ,  H01R13/518 ,  H01R12/79 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US10141667B2

公开(公告)日：2018-11-27

申请号：US15846282

申请日：2017-12-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/58 ,  H01R12/73 ,  H01R13/514 ,  H01R13/518 ,  H01R12/79 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US20170222344A1

公开(公告)日：2017-08-03

申请号：US15492258

申请日：2017-04-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/72 ,  H01R12/73 ,  H01R12/79 ,  H01R13/518 ,  H01R13/6471 ,  H01R12/58 ,  H01R13/514

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US09666965B2

公开(公告)日：2017-05-30

申请号：US14770108

申请日：2013-03-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  Deng Liu

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/73 ,  H01R13/514 ,  H01R13/518 ,  H01R12/58 ,  H01R13/6587

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US20180109022A1

公开(公告)日：2018-04-19

申请号：US15846282

申请日：2017-12-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/72 ,  H01R12/79 ,  H01R13/6471 ,  H01R13/518 ,  H01R12/73 ,  H01R12/58 ,  H01R13/514

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

公开(公告)号：US09882299B2

公开(公告)日：2018-01-30

申请号：US15492258

申请日：2017-04-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Deng Liu ,  Xiang Yao ,  Qilin Chen

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/58 ,  H01R12/73 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R12/79

CPC classification number: H01R12/722 ,  H01R12/585 ,  H01R12/724 ,  H01R12/732 ,  H01R12/79 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6471 ,  H01R13/6587

Abstract: The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.