公开(公告)号：US20230247751A1

公开(公告)日：2023-08-03

申请号：US18159643

申请日：2023-01-25

Applicant: 6K Inc.

Inventor： Michael C. Kozlowski ,  John Colwell ,  Richard K. Holman ,  Saurabh Ullal

IPC: H05H1/30 ,  C23C4/134

CPC classification number: H05H1/30 ,  C23C4/134 ,  H05H1/02

Abstract: The embodiments disclosed herein are directed to systems and devices which utilize multiple microwave plasmas can be used to increase the efficiency of traditional single microwave plasma systems. Disclosed herein is a microwave plasma apparatus for processing materials which includes a reaction chamber, a plurality of microwave plasma applicators in communication with the reaction chamber, one or more microwave radiation sources, at least one waveguide for guiding microwave radiation from the one or more microwave radiations sources to multiple plasma applicators, and a material feeding system in communication with the reaction chamber.

公开(公告)号：US20240417121A1

公开(公告)日：2024-12-19

申请号：US18705918

申请日：2022-10-24

Applicant: 6K Inc.

Inventor： Michael Kozlowski ,  David Hartung ,  Richard Malen ,  John Colwell

IPC: B65B37/04 ,  B23K10/02

Abstract: A pulsed control vibratory particle hopper includes a particle hopper, a vibrating tray, a mechanical vibrator, and a controller. The particle hopper includes a hopper outlet, and the vibrating tray receives particles from the hopper outlet. The mechanical vibrator is mechanically connected to the vibrating tray to generate a baseline vibration, as well as a periodic vibration amplitude spike or pulse. The controller is in communication with the mechanical vibrator to control the mechanical vibrator and generate the periodic vibration amplitude spike with a duration Tp, a maximum amplitude Ap, and a frequency Fp. The pulse duration, pulse amplitude, and pulse frequency are determined based on the size or a type of the material being dispensed from the particle hopper.

公开(公告)号：US12094688B2

公开(公告)日：2024-09-17

申请号：US18451720

申请日：2023-08-17

Applicant: 6K Inc.

Inventor： Michael C. Kozlowski ,  Ed Petersen ,  John Colwell ,  Anthony Andrew

IPC: H01J37/32

CPC classification number: H01J37/32201 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32642 ,  H01J2237/327

Abstract: Disclosed herein are systems, methods, and devices processing feed material utilizing a microwave plasma apparatus comprising a powder ingress preventor (PIP). In some embodiments, the microwave plasma apparatus comprises a core plasma tube and a liner; and a ring structure comprising: a bearing surface, the bearing surface contacting an interior diameter of the core plasma tube; and an opening, the opening contacting an outer diameter of the liner.

公开(公告)号：US20240071725A1

公开(公告)日：2024-02-29

申请号：US18451720

申请日：2023-08-17

Applicant: 6K Inc.

Inventor： Michael C. Kozlowski ,  Ed Petersen ,  John Colwell ,  Anthony Andrew

IPC: H01J37/32

CPC classification number: H01J37/32201 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32642 ,  H01J2237/327

Abstract: Disclosed herein are systems, methods, and devices processing feed material utilizing a microwave plasma apparatus comprising a powder ingress preventor (PIP). In some embodiments, the microwave plasma apparatus comprises a core plasma tube and a liner; and a ring structure comprising: a bearing surface, the bearing surface contacting an interior diameter of the core plasma tube; and an opening, the opening contacting an outer diameter of the liner.

公开(公告)号：US20240057245A1

公开(公告)日：2024-02-15

申请号：US18492507

申请日：2023-10-23

Applicant: 6K Inc.

Inventor： Michael C. Kozlowski ,  John Colwell ,  Richard K. Holman ,  Saurabh Ullal

IPC: H05H1/30 ,  C23C4/134

CPC classification number: H05H1/30 ,  C23C4/134 ,  H05H2242/24 ,  H05H1/02

Abstract: The embodiments disclosed herein are directed to systems and devices which utilize multiple microwave plasmas can be used to increase the efficiency of traditional single microwave plasma systems. Disclosed herein is a microwave plasma apparatus for processing materials which includes a reaction chamber, a plurality of microwave plasma applicators in communication with the reaction chamber, one or more microwave radiation sources, at least one waveguide for guiding microwave radiation from the one or more microwave radiations sources to multiple plasma applicators, and a material feeding system in communication with the reaction chamber.