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Patent Agency Ranking
公开(公告)号：US20220349745A1
公开(公告)日：2022-11-03
申请号：US17541284
申请日：2021-12-03
Inventor： Tingting Hong , Xingfu Chen
Abstract: One of the main objects of the present invention is to provide a vibration sensor with improved sensitivity. To achieve the above-mentioned object, the present invention provides a vibration sensor including a circuit board assembly; a housing fixed to the circuit board assembly for forming an accommodation space cooperatively with the circuit board assembly; and a diaphragm assembly accommodated in the accommodation space and secured to the circuit board assembly. The diaphragm assembly includes a gasket fixed to the circuit board assembly, and a first diaphragm fixed to a side of the gasket away from the circuit board assembly. The sensor further includes a vibration cavity enclosed by the gasket, the first diaphragm, and the circuit board assembly, and a MEMS microphone accommodated in the vibration cavity and electrically connected to the circuit board assembly.
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公开(公告)号：US20250016508A1
公开(公告)日：2025-01-09
申请号：US18399779
申请日：2023-12-29
Inventor： Xingfu Chen , Tangyu Zhang
Abstract: A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.
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公开(公告)号：US20220377480A1
公开(公告)日：2022-11-24
申请号：US17542524
申请日：2021-12-06
Inventor： Tingting Hong , Xing Yu , Xingfu Chen
Abstract: One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The vibration assembly includes a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board. The bone conduction microphone further includes a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal.
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公开(公告)号：US20250011158A1
公开(公告)日：2025-01-09
申请号：US18399742
申请日：2023-12-29
Inventor： Xingfu Chen , Zhiyuan Chen , Tangyu Zhang
IPC: B81B3/00
Abstract: The present disclosure discloses a MEMS microphone including a shell, a substrate assembled with the shell for forming a receiving space, an ASIC Die, a MEMS Die including a diaphragm and a back plate, and an elastic member. The diaphragm divides the receiving space into a front chamber and a rear chamber, the substrate comprises a first acoustic hole, a second acoustic hole, a connecting channel, and a ventilation hole, the MEMS Die covers the first acoustic hole which is communicating with the front chamber, the ventilation hole is communicating with the connecting channel and the rear chamber, the elastic member covering the ventilation hole is used for opening or closing the ventilation hole. Compared with the related art, a MEMS microphone disclosed by the present disclosure could have with high blowout resistance.
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公开(公告)号：US11665494B2
公开(公告)日：2023-05-30
申请号：US17542524
申请日：2021-12-06
Inventor： Tingting Hong , Xing Yu , Xingfu Chen
CPC classification number: H04R31/006 , H04R1/46 , H04R2460/13
Abstract: One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The vibration assembly includes a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board. The bone conduction microphone further includes a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal.
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