公开(公告)号：US20240223966A1

公开(公告)日：2024-07-04

申请号：US18395782

申请日：2023-12-26

Applicant: AAC Technologies Pte. Ltd.

Inventor： Yuwei Liu ,  Colin Robert Jenkins ,  Rui Zhang

IPC: H04R19/04 ,  B81B3/00 ,  H04R7/04 ,  H04R7/18

CPC classification number: H04R19/04 ,  B81B3/0075 ,  H04R7/04 ,  H04R7/18 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R2201/003

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.