公开(公告)号：US20130206370A1

公开(公告)日：2013-08-15

申请号：US13766163

申请日：2013-02-13

Applicant: ABB Oy

Inventor： Matti SMALÉN ,  Timo KOIVULUOMA ,  Matti KAUHANEN

IPC: H02K5/20

CPC classification number: H02K5/20 ,  H05K7/20254 ,  H05K7/20927

Abstract: An electronic apparatus includes an extruded metallic frame with walls which are integrated parts of the extruded metallic frame, at least one extruded flow channel in at least one of the walls for passing a cooling fluid within the respective wall, an inlet arranged outside the electronic apparatus and an outlet arranged outside the electronic apparatus for providing a flow path via the at least one extruded flow channel, and detachable covers which are attached to the walls for sealing off at least one electric component space from an outside of the electronic apparatus.

Abstract translation: 一种电子设备包括具有壁的挤出金属框架，其是挤压的金属框架的整体部分，至少一个挤压流动通道，用于使各个壁内的冷却流体通过，至少一个挤出流动通道，布置在电子设备外部的入口 以及布置在电子设备外部的出口，用于经由至少一个挤出流动通道提供流动通道，以及附接到壁的可拆卸盖，用于从电子设备的外部密封至少一个电气部件空间。