公开(公告)号：US20200350232A1

公开(公告)日：2020-11-05

申请号：US16846844

申请日：2020-04-13

Applicant: AUDI AG ,  ABB Schweiz AG

Inventor： Thomas GRADINGER ,  Daniele TORRESIN

IPC: H01L23/473 ,  H01L25/07 ,  H01L21/48

Abstract: A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

公开(公告)号：US20220196338A1

公开(公告)日：2022-06-23

申请号：US17560482

申请日：2021-12-23

Applicant: ABB Schweiz AG

Inventor： Daniele TORRESIN ,  Bruno AGOSTINI ,  Andrey Petrov

IPC: F28D15/04

Abstract: A heat-transfer device includes a bi-porous wick having at least one layer including a micro-porous body and tubular macro-pores, and a dense casing enclosing the wick, wherein the body and the macro-pores are fluidically interconnected and are at least partially overlapping inside the layer.

公开(公告)号：US20240353293A1

公开(公告)日：2024-10-24

申请号：US18292197

申请日：2022-06-08

Applicant: ABB SCHWEIZ AG

Inventor： Oleksandr SOLOGUBENKO ,  Daniele TORRESIN ,  Andrey PETROV ,  Bruno AGOSTINI

IPC: G01M99/00

CPC classification number: G01M99/002 ,  F28F2200/005

Abstract: A method for testing a two-phase cooling device is provided. The cooling device has a housing surrounding a cavity and a cooling medium within the cavity. The method includes controlling a temperature of ambient air of the cooling device such that the cooling medium within the cavity transitions from its liquid state to its solid state and/or from its solid state to its liquid state, while monitoring a first temperature of the cooling device, determining whether the monitored first temperature fulfills a predetermined criterion, and determining that the cooling device is overfilled with the cooling medium if the predetermined criterion is fulfilled.

公开(公告)号：US20210385973A1

公开(公告)日：2021-12-09

申请号：US17336323

申请日：2021-06-02

Applicant: ABB Schweiz AG

Inventor： Oleksandr SOLOGUBENKO ,  Daniele TORRESIN ,  Andrey PETROV ,  Bruno AGOSTINI

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04 ,  F28F1/12

Abstract: A loop heat pipe includes: an evaporator having an enclosure with a heat receiving side and side walls with openings forming an evaporator chamber, the evaporator chamber including a primary capillary structure adjacent to the heat receiving side of the enclosure and extending to the side walls of the evaporator chamber, a plurality of grooves in the primary capillary structure, each of which extends from an opening in one of the side walls to an opening in an opposite side wall, the plurality of grooves transporting vapor from the primary capillary structure to the openings; and a condenser.