公开(公告)号：US11419241B2

公开(公告)日：2022-08-16

申请号：US16604476

申请日：2018-04-04

Applicant: ABB Schweiz AG

Inventor： Tor Laneryd ,  Thomas Gradinger ,  Heinz Lendenmann ,  Thomas Wagner ,  Hui Huang ,  Kim Missing ,  Mika Norolampi

IPC: H05K7/20 ,  F28F1/40 ,  H01L23/473

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the at least one pipe; wherein the at least one heat exchanging element is arranged to press laterally outwards against an internal surface of the at least one pipe to establish a heat transfer bond between the at least one heat exchanging element and the at least one pipe. A subsea electronic system including the heat exchanging arrangement is also provided.

公开(公告)号：US20170365535A1

公开(公告)日：2017-12-21

申请号：US15586928

申请日：2017-05-04

Applicant: ABB Schweiz AG

Inventor： David Guillon ,  Heinz Lendenmann ,  Hui Huang

IPC: H01L23/29 ,  H01L29/739 ,  H01L23/06

CPC classification number: H01L23/29 ,  H01L23/051 ,  H01L23/06 ,  H01L23/3121 ,  H01L29/7393 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: The present disclosure relates to a high voltage power electronics module for subsea applications. The power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus less in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

公开(公告)号：US09984948B2

公开(公告)日：2018-05-29

申请号：US15586928

申请日：2017-05-04

Applicant: ABB Schweiz AG

Inventor： David Guillon ,  Heinz Lendenmann ,  Hui Huang

IPC: H01L23/29 ,  H01L23/06 ,  H01L29/739 ,  H01L23/31 ,  H01L23/051

CPC classification number: H01L23/29 ,  H01L23/051 ,  H01L23/06 ,  H01L23/3121 ,  H01L29/7393 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

公开(公告)号：US20200383239A1

公开(公告)日：2020-12-03

申请号：US16604476

申请日：2018-04-04

Applicant: ABB Schweiz AG

Inventor： Tor Laneryd ,  Thomas Gradinger ,  Heinz Lendenmann ,  Thomas Wagner ,  Hui Huang ,  Kim Missing ,  Mika Norolampi

IPC: H05K7/20 ,  F28F1/40

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the at least one pipe; wherein the at least one heat exchanging element is arranged to press laterally outwards against an internal surface of the at least one pipe to establish a heat transfer bond between the at least one heat exchanging element and the at least one pipe. A subsea electronic system including the heat exchanging arrangement is also provided.