公开(公告)号：US20150173242A1

公开(公告)日：2015-06-18

申请号：US14627513

申请日：2015-02-20

Applicant: ABB Technology AG

Inventor： Anders BLOMBERG ,  Bruno Agostini ,  Jing NI ,  Jürgen HAFNER ,  Mathieu HABERT

IPC: H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0241 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2270/00 ,  H01L23/427 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/20936 ,  H01L2924/00

Abstract: An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.

Abstract translation: 提供了用于冷却多个电子部件的示例性模块化冷却系统。 冷却系统包括多个冷却模块和夹紧装置。 每个冷却模块包括蒸发器单元，冷凝器，第一管道系统和第二管道系统。 夹紧装置适于保持和按压交替堆叠，其中蒸发器单元与功率电子部件交替堆叠。