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    MECHANICAL ASSEMBLY AND METHOD TO PROVIDE FORM-FACTOR AND WIRE ALIKE ADAPTATION OF EXISTING PLATFORM HARDWARE MODULES INTO NEW PRODUCTS
    2.
    发明申请
    MECHANICAL ASSEMBLY AND METHOD TO PROVIDE FORM-FACTOR AND WIRE ALIKE ADAPTATION OF EXISTING PLATFORM HARDWARE MODULES INTO NEW PRODUCTS 有权
    机械装配和提供现有平台硬件模块到新产品的形式因素和线路适配的方法

    公开(公告)号：US20150062833A1

    公开(公告)日：2015-03-05

    申请号：US14013077

    申请日：2013-08-29

    Applicant: ABB Technology AG

    Inventor： Shamsi Ismayilov ,  Yaser A. Khalifa ,  Frantisek Koudelka ,  Arkady Oksengorn ,  Siu Lau ,  Hardik Patel ,  In Y. Choi

    IPC: H05K7/14 ,  H05K3/32

    CPC classification number: H05K7/1432 ,  H05K3/32 ,  H05K7/1464 ,  Y10T29/4913

    Abstract: An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.

    Abstract translation: 智能电子设备（IED）包括多个硬件模块，包括一对模拟输入模块（AIM）模块，电源模块（PSM）和二进制输入/输出（BIO）模块。 每个模块被配置为安装在具有第一外形尺寸的第一IED外壳中。 PSM和BIO模块被构造和布置成直接连接第一壳体的电连接。 提供了具有与第一形状因子不同的第二形状因数的第二IED壳体。 AIM模块安装在第二壳体的底板上。 PSM和BIO模块安装在第二个外壳中。 接线将AIM模块电连接到第二个外壳上的连接。 适配器结构将PSM和BIO模块与第二壳体的相关连接电连接。

    Mechanical assembly and method to provide form-factor and wire alike adaptation of existing platform hardware modules into new products
    3.
    发明授权
    Mechanical assembly and method to provide form-factor and wire alike adaptation of existing platform hardware modules into new products 有权
    机械装配和方法，将现有平台硬件模块的外形和电线相似，适应新产品

    公开(公告)号：US09510475B2

    公开(公告)日：2016-11-29

    申请号：US14013077

    申请日：2013-08-29

    Applicant: ABB Technology AG

    Inventor： Shamsi Ismayilov ,  Yaser A. Khalifa ,  Frantisek Koudelka ,  Arkady Oksengorn ,  Siu Lau ,  Hardik Patel ,  In Y. Choi

    IPC: H05K7/00 ,  H05K7/14 ,  H05K3/32

    CPC classification number: H05K7/1432 ,  H05K3/32 ,  H05K7/1464 ,  Y10T29/4913

    Abstract: An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.

    Abstract translation: 智能电子设备（IED）包括多个硬件模块，包括一对模拟输入模块（AIM）模块，电源模块（PSM）和二进制输入/输出（BIO）模块。 每个模块被配置为安装在具有第一外形尺寸的第一IED外壳中。 PSM和BIO模块被构造和布置成直接连接第一壳体的电连接。 提供了具有与第一形状因子不同的第二形状因数的第二IED壳体。 AIM模块安装在第二壳体的底板上。 PSM和BIO模块安装在第二个外壳中。 接线将AIM模块电连接到第二个外壳上的连接。 适配器结构将PSM和BIO模块与第二壳体的相关连接电连接。

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