公开(公告)号：US20190144671A1

公开(公告)日：2019-05-16

申请号：US16304454

申请日：2017-04-27

Applicant: ADEKA CORPORATION

Inventor： Hiroki AKATSU ,  Takashi AYABE

IPC: C08L81/02 ,  C08L67/04 ,  C08L77/00 ,  C08K5/3492 ,  C08K5/3475 ,  B29C45/00 ,  B29C48/00

Abstract: A resin composition including: (A) 100 parts by mass of a resin selected from the group consisting of polyamide, polylactic acid, and polyphenylene sulfide each having a melting point of 170° C. to 370° C.; (B) 0.05 to 5.0 parts by mass of a triazine compound represented by general formula (1); (C) 0 to 3.0 parts by mass of a specific oxidizing agent; and (D) 0 to 1.0 part by mass of a specific light stabilizer.