公开(公告)号：US10144799B2

公开(公告)日：2018-12-04

申请号：US14913431

申请日：2014-08-18

Applicant: ADEKA CORPORATION

Inventor： Ryo Ogawa ,  Takuya Matsuda

IPC: C08G59/66 ,  C08G59/24 ,  C08G59/50 ,  C08G59/56

Abstract: A one-component curable resin composition that does not contain an isocyanate compound, comprised of uniformly blended (A) a compound having two or more epoxy groups within a molecule, (B) a compound having two or more thiol groups within a molecule, and (C) an imidazole compound of formula (I), wherein the component (C) exists in the form of liquid.

公开(公告)号：US10344191B2

公开(公告)日：2019-07-09

申请号：US15312736

申请日：2015-05-22

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kenji Koga ,  Daisuke Takama ,  Ryo Ogawa ,  Shinsuke Yamada ,  Takuya Matsuda

IPC: C09J163/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08G59/50 ,  C08L79/04

Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.