公开(公告)号：US20210238421A1

公开(公告)日：2021-08-05

申请号：US17237294

申请日：2021-04-22

Applicant: ADMATECHS CO., LTD.

Inventor： Shingi NOGUCHI ,  Masaru KURAKI ,  Tempo NAKAMURA ,  Yoshinori OKAWAUCHI

IPC: C08L83/06 ,  C08K3/013 ,  C08K3/22

Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.