公开(公告)号：US20210238421A1

公开(公告)日：2021-08-05

申请号：US17237294

申请日：2021-04-22

Applicant: ADMATECHS CO., LTD.

Inventor： Shingi NOGUCHI ,  Masaru KURAKI ,  Tempo NAKAMURA ,  Yoshinori OKAWAUCHI

IPC: C08L83/06 ,  C08K3/013 ,  C08K3/22

Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.

公开(公告)号：US20210017392A1

公开(公告)日：2021-01-21

申请号：US17060138

申请日：2020-10-01

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Masaru KURAKI

IPC: C09C1/40 ,  C01B39/20 ,  C01B39/36 ,  C09D11/037

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.