公开(公告)号：US20210326063A1

公开(公告)日：2021-10-21

申请号：US16848920

申请日：2020-04-15

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ANIRBAN NAG ,  NUWAN JAYASENA ,  SHAIZEEN AGA

IPC: G06F3/06 ,  G06F9/448 ,  G06F9/48

Abstract: Memory operations using compound memory commands, including: receiving, by a memory module, a compound memory command indicating one or more operations to be applied to each portion of a plurality of portions of contiguous memory in the memory module; generating, based on the compound memory command, a plurality of memory commands to apply the one or more operations to each portion of the plurality of portions of contiguous memory; and executing the plurality of memory commands.

公开(公告)号：US20210303355A1

公开(公告)日：2021-09-30

申请号：US16828190

申请日：2020-03-24

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ANIRBAN NAG ,  NUWAN JAYASENA ,  SHAIZEEN AGA

IPC: G06F9/50 ,  G06F9/54 ,  G06F12/0882 ,  G06F12/02 ,  G06F12/1027

Abstract: Memory allocation for processing-in-memory operations, including: receiving, by an allocation module, a memory allocation request indicating a plurality of data structure operands for a processing-in-memory operation; determining a memory allocation pattern for the plurality of data structure operands, wherein the memory allocation pattern interleaves a plurality of component pages of a memory page across the plurality of data structure operands; and allocating the memory page based on the determined memory allocation pattern.