Patent search ap:("ADVANCED MICRO DEVICES Page INC.") AND inv:"I-Tseng Lee"

1.

发明申请
METHOD AND APPARATUS FOR CHIP MANUFACTURING 有权

公开(公告)号：US20220208559A1

公开(公告)日：2022-06-30

申请号：US17137562

申请日：2020-12-30

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Ai-Tee Ang , I-Tseng Lee

IPC: H01L21/56 , H01L23/31 , H01L21/67 , H01L25/07

Abstract: Chip manufacturing, including: assembling at least two chips on a layer; and applying mold compound on the at least two chips to the sides and bottom including flowing around interconnects, thereby leaving the top of each of the at least two chips exposed.

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