公开(公告)号：US20240203736A1

公开(公告)日：2024-06-20

申请号：US18065816

申请日：2022-12-14

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： GABRIEL H. LOH ,  TODD DAVID BASSO ,  STEVEN TU ,  JOSHUA A. HORT ,  CHIA-KEN LEONG ,  BENJAMIN BEKER ,  ANWAR P. KASHEM

IPC: H01L21/02 ,  H01L21/683

CPC classification number: H01L21/02697 ,  H01L21/6835

Abstract: A substrate includes a location for coupling one or more chiplets to the substrate. The location has dimensions that bound dimensions of chiplets capable of being coupled to the substrate in the location. Additionally, the location includes an interface region having connections for one or more die-to-die interfaces of the one or more chiplets and a power region that includes a power interface having connections for the one or more chiplets.