公开(公告)号：US20250006496A1

公开(公告)日：2025-01-02

申请号：US18345233

申请日：2023-06-30

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHIA CHUN MIAO ,  SUNGJUN IM ,  HIMANSHU A BAL

IPC: H01L21/033 ,  H01L21/304 ,  H01L23/367

Abstract: A method for forming a lid of a semiconductor assembly includes applying a mask to a surface of the lid to leave an area of the lid including a pedestal and wider than the pedestal included in the lid exposed. The method applies a thermally conductive material to the area of the surface of the lid that is exposed and removes at least a portion of the thermally conductive material from the surface of the lid.