公开(公告)号：US20240071940A1

公开(公告)日：2024-02-29

申请号：US18505187

申请日：2023-11-09

申请人： ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

发明人： RAHUL AGARWAL ,  RAJA SWAMINATHAN ,  MICHAEL S. ALFANO ,  GABRIEL H. LOH ,  ALAN D. SMITH ,  GABRIEL WONG ,  MICHAEL MANTOR

IPC分类号： H01L23/538 ,  H01L21/50 ,  H01L25/065 ,  H01L27/06

CPC分类号： H01L23/5384 ,  H01L21/50 ,  H01L23/5381 ,  H01L23/5385 ,  H01L25/0657 ,  H01L27/0688

摘要： A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.