公开(公告)号：US20140308778A1

公开(公告)日：2014-10-16

申请号：US14313046

申请日：2014-06-24

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Kuang-Hsiung Chen ,  Sheng-Ming Wang ,  Yu-Ying Lee ,  Hsiang-Ming Feng ,  Bing-Yun Cheng

IPC: H01L21/56

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00

Abstract: An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices is attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages.

Abstract translation: 制造半导体器件封装的方法的实施例包括散热器矩阵和衬底。 多个半导体器件附接到基板。 然后，在散热片基板和基板之间形成封装体，其中封装体封装半导体器件。 然后，形成多个第一切割槽，其中第一切割槽延伸穿过散热器矩阵并且部分地延伸到包装主体中。 然后，形成多个第二切割槽，其中第二切割槽延伸穿过基板并通过封装主体延伸到第一切割槽，从而将散热器矩阵和基板分离成多个单独的半导体器件封装。

公开(公告)号：US09054118B2

公开(公告)日：2015-06-09

申请号：US14313046

申请日：2014-06-24

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Kuang-Hsiung Chen ,  Sheng-Ming Wang ,  Yu-Ying Lee ,  Hsiang-Ming Feng ,  Bing-Yun Cheng

IPC: H01L21/56 ,  H01L23/34 ,  H01L23/433 ,  H01L23/00

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00

Abstract: An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices is attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages.

Abstract translation: 制造半导体器件封装的方法的实施例包括散热器矩阵和衬底。 多个半导体器件附接到基板。 然后，在散热片基板和基板之间形成封装体，其中封装体封装半导体器件。 然后，形成多个第一切割槽，其中第一切割槽延伸穿过散热器矩阵并且部分地延伸到包装主体中。 然后，形成多个第二切割槽，其中第二切割槽延伸穿过基板并通过封装主体延伸到第一切割槽，从而将散热器矩阵和基板分离成多个单独的半导体器件封装。