公开(公告)号：US20200371158A1

公开(公告)日：2020-11-26

申请号：US16860515

申请日：2020-04-28

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Yuya Yamada ,  Shintaro Takaki ,  Hiroki Hosogai

IPC: G01R31/28 ,  G01R1/04

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.

公开(公告)号：USD796978S1

公开(公告)日：2017-09-12

申请号：US29560253

申请日：2016-04-05

Applicant: ADVANTEST CORPORATION

Designer： Takashi Kawashima ,  Shintaro Takaki

公开(公告)号：US11181576B2

公开(公告)日：2021-11-23

申请号：US16860515

申请日：2020-04-28

Applicant: ADVANTEST Corporation

Inventor： Yasuyuki Kato ,  Yuya Yamada ,  Shintaro Takaki ,  Hiroki Hosogai

IPC: G01R31/28 ,  G01R1/04

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.