公开(公告)号：US20200154528A1

公开(公告)日：2020-05-14

申请号：US16746107

申请日：2020-01-17

Applicant: AGC INC.

Inventor： Yuhei GIMA ,  Seiichi MIYASAKA ,  Shigeru NAKAMURA

IPC: H05B3/86 ,  H05B3/34 ,  B32B17/10

Abstract: A laminated glass includes a pair of glass plates facing each other, a pair of intermediate adhesive layers positioned between the pair of glass plates and in contact with the respective glass plates, a wiring positioned between the pair of intermediate adhesive layers, and one set of bus bars connected to the wiring. The wiring includes conductive thin wires arranged in parallel with each other between the bus bars. The bus bars are arranged alongside a same edge of the glass plates. In an area corresponding to at least a part of a principal face of the glass plates, the conductive thin wires are arranged as one aggregation and include at least one turnaround. A resistance value of each of the conductive thin wires is within a range of 10% or less with respect to an average value of resistance values of the conductive thin wires.

公开(公告)号：US20190160920A1

公开(公告)日：2019-05-30

申请号：US16264743

申请日：2019-02-01

Applicant: AGC INC.

Inventor： Seiichi MIYASAKA ,  Yuhei Gima ,  Tokihiko Aoki

IPC: B60J1/00 ,  B32B17/10 ,  B60S1/02 ,  B60J1/02 ,  H05B3/26 ,  H05B3/84

Abstract: A laminated glass includes a pair of glass plates opposite each other; a pair of intermediate bonding layers located between the pair of glass plates, each of the intermediate bonding layers contacting a corresponding glass plate of the glass plates; and a base film located between the pair of intermediate bonding layers, and being provided with a wiring in at least a partial area of the base film. A thickness of one of the intermediate bonding layers is thinner than a thickness of another one of the intermediate bonding layers. A thickness of a thinner intermediate bonding layer of the pair of intermediate bonding layers is 0.20 mm or less.