公开(公告)号：US20190107762A1

公开(公告)日：2019-04-11

申请号：US16209963

申请日：2018-12-04

Applicant: AGC INC. ,  AGC GLASS EUROPE ,  AGC FLAT GLASS NORTH AMERICA, INC. ,  AGC VIDROS DO BRASIL LTDA.

Inventor： Shigeru NAKAMURA ,  Tetsuya HIRAMATSU

IPC: G02F1/153 ,  G02F1/163 ,  B32B17/10

Abstract: A dimming laminate (10) includes: a dimming substrate (18) in which a dimming function material (16) is provided between two first transparent substrates (12) and (14); and a second transparent substrate (22) that is bonded to one first transparent substrate (12) through an adhesive layer (20). Each of the first transparent substrates (12) and (14) has a different average thermal expansion coefficient at 50-350° C. from that of the second transparent substrate (22). In the dimming laminate (10), a third transparent substrate (26) is bonded to the other first transparent substrate (14) through an adhesive layer (24), and an average thermal expansion coefficient at 50-350° C. is equal between the third transparent substrate (26) and the second transparent substrate (22).

公开(公告)号：US20200154528A1

公开(公告)日：2020-05-14

申请号：US16746107

申请日：2020-01-17

Applicant: AGC INC.

Inventor： Yuhei GIMA ,  Seiichi MIYASAKA ,  Shigeru NAKAMURA

IPC: H05B3/86 ,  H05B3/34 ,  B32B17/10

Abstract: A laminated glass includes a pair of glass plates facing each other, a pair of intermediate adhesive layers positioned between the pair of glass plates and in contact with the respective glass plates, a wiring positioned between the pair of intermediate adhesive layers, and one set of bus bars connected to the wiring. The wiring includes conductive thin wires arranged in parallel with each other between the bus bars. The bus bars are arranged alongside a same edge of the glass plates. In an area corresponding to at least a part of a principal face of the glass plates, the conductive thin wires are arranged as one aggregation and include at least one turnaround. A resistance value of each of the conductive thin wires is within a range of 10% or less with respect to an average value of resistance values of the conductive thin wires.