Substrate and metal laminate
    1.
    发明授权

    公开(公告)号:US12012498B2

    公开(公告)日:2024-06-18

    申请号:US17580798

    申请日:2022-01-21

    Applicant: AGC Inc.

    CPC classification number: C08K3/36 C08J5/18 C08J2327/18

    Abstract: A substrate with a tetrafluoroethylene polymer and an inorganic filler, wherein the proportion of the total volume of the tetrafluoroethylene polymer and the inorganic filler to the total volume of the present substrate is at least 80 vol %, and the substrate has a rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm thick specimen cut out from the substrate is at most 30%.

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