公开(公告)号：US10264672B2

公开(公告)日：2019-04-16

申请号：US15962076

申请日：2018-04-25

申请人： AGC Inc.

发明人： Shigetoshi Mori ,  Motoshi Ono ,  Mamoru Isobe ,  Kohei Horiuchi

IPC分类号： H01B17/56 ,  H05K1/03 ,  H05K1/11

摘要： A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

公开(公告)号：US12012498B2

公开(公告)日：2024-06-18

申请号：US17580798

申请日：2022-01-21

申请人： AGC Inc.

发明人： Motoshi Ono ,  Kanji Arai

IPC分类号： C08K3/36 ,  C08J5/18

CPC分类号： C08K3/36 ,  C08J5/18 ,  C08J2327/18

摘要： A substrate with a tetrafluoroethylene polymer and an inorganic filler, wherein the proportion of the total volume of the tetrafluoroethylene polymer and the inorganic filler to the total volume of the present substrate is at least 80 vol %, and the substrate has a rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm thick specimen cut out from the substrate is at most 30%.

公开(公告)号：US11179809B2

公开(公告)日：2021-11-23

申请号：US16375036

申请日：2019-04-04

申请人： AGC INC.

发明人： Motoshi Ono

IPC分类号： C03C15/00 ,  B23K26/362 ,  C03B25/02 ,  B23K26/08 ,  B23K26/402 ,  B23K26/60 ,  H01L21/48 ,  B23K26/382 ,  B23K26/70 ,  H01L23/15 ,  B23K103/00

摘要： A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.

公开(公告)号：US10442720B2

公开(公告)日：2019-10-15

申请号：US15276990

申请日：2016-09-27

申请人： AGC Inc.

发明人： Kohei Horiuchi ,  Motoshi Ono

IPC分类号： C03B33/08 ,  B23K26/073 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/402 ,  B23K103/00

摘要： Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

公开(公告)号：US10201867B2

公开(公告)日：2019-02-12

申请号：US14965111

申请日：2015-12-10

申请人： AGC Inc.

发明人： Motoshi Ono

IPC分类号： C03B33/10 ,  C03C23/00 ,  B23K9/013 ,  B23K26/382 ,  B26F1/28 ,  B23K26/384 ,  B23K103/00

摘要： Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ  (1), and 0.16≤sin θ≤0.22  (2).

公开(公告)号：US11894625B2

公开(公告)日：2024-02-06

申请号：US17643232

申请日：2021-12-08

申请人： AGC Inc.

发明人： Yasuo Morimoto ,  Takeshi Motegi ,  Toshiki Sayama ,  Motoshi Ono ,  Osamu Kagaya

IPC分类号： H01Q9/16 ,  H01Q7/00 ,  H05K1/02

CPC分类号： H01Q9/16 ,  H01Q7/00 ,  H05K1/0277 ,  H05K2201/10098

摘要： An antenna includes an antenna conductor to be provided on an exterior side of a chassis and a flexible substrate. The flexible substrate includes a first insulating portion that is a portion of a sheet-shaped dielectric where the sheet-shaped dielectric is folded, a grounding conductor provided between the first insulating portion and the chassis, a second insulating portion that is a portion of the sheet-shaped dielectric where the sheet-shaped dielectric is not folded, and a signal line configured to feed power to the antenna conductor. A thickness of the first insulating portion is greater than a thickness of the second insulating portion.

公开(公告)号：US10531566B2

公开(公告)日：2020-01-07

申请号：US16030216

申请日：2018-07-09

申请人： AGC Inc.

发明人： Mamoru Isobe ,  Motoshi Ono ,  Shigetoshi Mori ,  Kohei Horiuchi

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  B23K26/046 ,  B23K26/064 ,  B23K26/382 ,  B23K26/402 ,  B23K26/142

摘要： A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

公开(公告)号：US11123822B2

公开(公告)日：2021-09-21

申请号：US15472636

申请日：2017-03-29

申请人： AGC Inc.

发明人： Motoshi Ono

IPC分类号： B23K26/382 ,  B23K26/402 ,  B23K103/00

摘要： A manufacturing method for a glass substrate having a hole with a depth of d (μm) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (μsec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (μsec) satisfies t≥10×d/(Pd)1/2.

公开(公告)号：US10584053B2

公开(公告)日：2020-03-10

申请号：US15666946

申请日：2017-08-02

申请人： AGC Inc.

发明人： Motoshi Ono

IPC分类号： C03B33/08 ,  B23K26/382 ,  B23K26/402 ,  C03B17/06 ,  C03C15/00 ,  B23K26/00 ,  B23K26/359 ,  B23K26/352 ,  C03C23/00 ,  B23K103/00

摘要： A manufacturing method of a glass substrate with a hole having a diameter ϕf, and with a thickness θf includes setting a thickness θ1 of a glass plate that is to be processed; preparing a glass plate with the thickness θ1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ϕ1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ϕf on the first surface is formed, and a thickness of the glass plate is adjusted from θ1 to a target value of θf.