公开(公告)号：US20190021170A1

公开(公告)日：2019-01-17

申请号：US16030216

申请日：2018-07-09

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Motoshi ONO ,  Shigetoshi MORI ,  Kohei HORIUCHI

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  B23K26/046 ,  B23K26/064 ,  B23K26/142 ,  B23K26/382 ,  B23K26/402

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

公开(公告)号：US20230086962A1

公开(公告)日：2023-03-23

申请号：US18071241

申请日：2022-11-29

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Shigetoshi MORI ,  Kohei HORIUCHI

IPC: B23K26/362 ,  B23K26/382 ,  B23K26/402

Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.