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公开(公告)号:US11267761B2
公开(公告)日:2022-03-08
申请号:US16567055
申请日:2019-09-11
Applicant: AGC Inc.
Inventor: Shuhei Ogawa , Naomichi Miyakawa , Yasuo Shinozaki , Haruhiko Yoshino , Kazunari Tohyama , Kazuto Ohkoshi
IPC: C04B35/117 , C04B38/00 , C04B38/06
Abstract: The present invention relates to a light-transmitting ceramic sintered body which contains air voids having pore diameters of 1 μm or more but less than 5 μm at a density within the range of from 10 voids/mm3 to 4,000 voids/mm3 (inclusive), while having a closed porosity of from 0.01% by volume to 1.05% by volume (inclusive). With respect to this light-transmitting ceramic sintered body, a test piece having a thickness of 1.90 mm has an average transmittance of 70% or more in the visible spectrum wavelength range of 500-900 nm, and the test piece having a thickness of 1.90 mm has a sharpness of 60% or more at a comb width of 0.5 mm.
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公开(公告)号:US11964450B2
公开(公告)日:2024-04-23
申请号:US17575843
申请日:2022-01-14
Applicant: AGC Inc.
Inventor: Shuhei Ogawa , Norihito Nakazawa , Shuhei Nomura
CPC classification number: B32B17/10018 , B32B9/045 , B32B17/10 , B32B18/00 , B32B27/28 , B32B2307/30 , B32B2307/412 , B32B2307/546 , B32B2307/72
Abstract: A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a ceramic member provided on or above the bonding layer, the ceramic member being constituted by an SiC member or an AlN member.
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公开(公告)号:US11958269B2
公开(公告)日:2024-04-16
申请号:US17575827
申请日:2022-01-14
Applicant: AGC Inc.
Inventor: Shuhei Ogawa , Shuhei Nomura , Norihito Nakazawa
CPC classification number: B32B17/10082 , B32B9/045 , B32B17/10 , B32B17/10036 , B32B27/28 , B32B2250/03 , B32B2307/30 , B32B2307/412 , B32B2307/546 , B32B2307/72 , B32B2307/732
Abstract: A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a Si—SiC member provided on or above the bonding layer.
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